Intel X5365 Design Guide - Page 54
CEK Spring supplied by baseboard vendors, Heatsink standoffs supplied by chassis vendors
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Thermal/Mechanical Reference Design The other items listed in Figure 2-16 that are required to complete this solution will be shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) § 54 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
Thermal/Mechanical Reference Design
54
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
The other items listed in
Figure 2-16
that are required to complete this solution will be
shipped with either the chassis or boards. They are as follows:
•
CEK Spring (supplied by baseboard vendors)
•
Heatsink standoffs (supplied by chassis vendors)
§