Intel X5365 Design Guide - Page 9
Introduction, 1.1 Objective, 1.2 Scope, 1.3 References, Objective, Scope - xeon processors
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Introduction 1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for Quad-Core Intel® Xeon® Processor 5300 Series. The Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of the product. These processors are performance-optimized and provide optimal overall performance. The Quad-Core Intel® Xeon® Processor E5300 Series refers to the 80W TDP skus of the product. These processors are rack-optimized and provide optimal performance per watt. The Quad-Core Intel® Xeon® Processor L5300 Series refers to the 50W TDP skus of the product. These processors are rack-optimized and provide optimal power efficiency. Unless other stated, all reference to "Quad-Core Intel® Xeon® Processor 5300 Series" in this document pertain to the Quad-Core Intel® Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed on the entire life of the processor. The thermal/mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible thermal/mechanical solutions. 1.2 Scope The thermal/mechanical solutions described in this document pertain to a solution(s) intended for use with the Quad-Core Intel® Xeon® Processor 5300 Series in 1U, 2U, 2U+ and workstation form factors systems. This document contains the mechanical and thermal requirements of the processor cooling solution. In case of conflict, the data in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet supersedes any data in this document. Additional information is provided as a reference in the appendices. 1.3 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents (Sheet 1 of 2) Document European Blue Angel Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers Platform Design Guide (PDG) Stoakley Platform Design Guide (PDG) PECI Feature Set Overview Comment http://www.blauer-engel.de See Note at bottom table. http://developer.intel.com/ See Note following table. See Note following table. See Note following table. See Note following table. See Note following table. See Note following table Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 9