Intel X5365 Design Guide - Page 58
U CEK Reference Solution, Thermal Profile, Y=0.360*X+42, Equation A-2. y = 0.325x + 40
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1U Alternative Heatsink Thermal/Mechanical Design The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors. From Table A-1 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.325 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation A-2. y = 0.325x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure A-4 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 2.8°C margin at the lower end (P_PROFILE_MIN) and 3.7°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions. Figure A-4. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 60 TCASE_MAX @ TDP Thermal Profile Y=0.360*X+42 55 TCASE_MAX @P _PROFILE_MIN 50 Temperature ( C ) 45 1U CEK Reference Solution Y=0.325*X+40 40 0 5 10 15 20 25 30 P_ PROFILE_MIN 35 40 45 Power (W) 50 TDP § 58 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)