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Intel X5365 Design Guide - Page 50

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Thermal/Mechanical Reference Design 2.4.7.3 CEK Spring The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has four embosses which, when assembled, rest on the top of the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink standoffs. The purpose of the CEK spring is to provide compressive preload at the TIM interface when the baseboard is pushed down upon it. This spring does not function as a clip of any kind. The two tabs on the spring are used to provide the necessary compressive preload for the TIM when the whole solution is assembled. The tabs make contact on the secondary side of the baseboard. In order to avoid damage to the contact locations on the baseboard, the tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent). Figure 2-25 shows an isometric view of the CEK spring design. Figure 2-25. CEK Spring Isometric View Figure 2-26. Isometric View of CEK Spring Attachment to the Base Board Secondary Primary Please refer to Appendix B for more detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix B must be met to use this CEK spring design. 50 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

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Thermal/Mechanical Reference Design

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

2.4.7.3

CEK Spring

The CEK spring, which is attached on the secondary side of the baseboard, is made

from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of

the spring will be made from a similar material. The CEK spring has four embosses

which, when assembled, rest on the top of the chassis standoffs. The CEK spring is

located between the chassis standoffs and the heatsink standoffs. The purpose of the

CEK spring is to provide compressive preload at the TIM interface when the baseboard

is pushed down upon it. This spring does not function as a clip of any kind. The two

tabs on the spring are used to provide the necessary compressive preload for the TIM

when the whole solution is assembled. The tabs make contact on the secondary side of

the baseboard. In order to avoid damage to the contact locations on the baseboard, the

tabs are insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent).

Figure 2-25

shows an isometric view of the CEK spring design.

Please refer to

Appendix B

for more detailed mechanical drawings of the CEK spring.

Also, the baseboard keepout requirements shown in

Appendix B

must be met to use

this CEK spring design.

Figure 2-25. CEK Spring Isometric View

Figure 2-26. Isometric View of CEK Spring Attachment to the Base Board

Secondary

Primary

Secondary

Primary