Intel X5365 Design Guide - Page 21

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

21

Thermal/Mechanical Reference Design

2.2.4

Multiple Core Special Considerations

2.2.4.1

Multiple Digital Thermal Sensor Operation

Each Quad-Core Intel® Xeon® Processor 5300 Series processor can have multiple

Digital Thermal Sensors located on the die. Each die within the processor currently

maps to a PECI domain. The Quad-Core Intel® Xeon® Processor 5300 Series contains

two dies (Domains) and each die contains two cores. BIOS will be responsible for

detecting the proper processor type and providing the number of domains to the

thermal management system. An external PECI device that is part of the thermal

management system polls the processor domains for temperature information and

currently receives the highest of the DTS output temperatures within each domain.

Figure 2-5

provides an illustration of the DTS domains for the Quad-Core Intel® Xeon®

Processor 5300 Series.

2.2.4.2

Thermal Monitor for Multiple Core Products

The thermal management for multiple core products has only one T

CONTROL

value per

processor. The T

CONTROL

for processor 0 and T

CONTROL

for processor 1 are independent

from each other. If the DTS temperature from any domain within the processor is

greater than or equal to T

CONTROL

, the processor case temperature must remain at or

below the temperature as specified by the thermal profile. See

Section 2.2.6

for

information on T

CONTROL

. The PECI signal is available through CPU pin (G5) on each

LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Through this

pin, the dual domains receive all temperature sensor values and provide the current

hottest value to an external PECI device such as a thermal management system.

Figure 2-5.

DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series

Fan Speed Controller

PECI Host

T

CONTROL

for

Processor 0

Socket 0

Domain 0

Core_1

DTS_1

Core_2

DTS_2

Core_3

DTS_3

Core_4

DTS_4

Domain 1

Socket 1

Domain 0

Core_1

DTS_1

Core_2

DTS_2

Core_3

DTS_3

Core_4

DTS_4

Domain 1

T

CONTROL

for

Processor 1

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 21

Multiple Core Special Considerations - cpu

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