Intel X5365 Design Guide - Page 13

Thermal/Mechanical Reference Design, 2.1 Mechanical Requirements

Get Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor PDF manuals and user guides
UPC - 735858199292
View all Intel X5365 manuals
Add to My Manuals
Save this manual to your list of manuals

Page 13 highlights

Thermal/Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor X5300 Series is the performance-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. Quad-Core Intel® Xeon® Processor E5300 Series is a rack-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. Both Quad-Core Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300 Series are targeted for the full range of form factors (2U, 2U+ and 1U/volumetrically constrained). The Quad-Core Intel® Xeon® Processor L5300 Series is a power-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. The Quad-Core Intel® Xeon® Processor L5300 Series is targeted for volumetrically constrained form factors (1U, server blades and embedded servers). 2.1 Mechanical Requirements The mechanical performance of the processor cooling solution must satisfy the requirements described in this section. 2.1.1 Processor Mechanical Parameters Table 2-1. Processor Mechanical Parameters Table Parameter Volumetric Requirements and Keepouts Static Compressive Load Static Board Deflection Dynamic Compressive Load Transient Bend Shear Load Minimum Tensile Load Torsion Load Maximum 70 311 25 111 35 3.95 Unit lbf N lbf N in*lbf N*m Notes 1 3 3 3 3 2,4,5 2,4,6 2,4,7 Notes: 1. Refer to drawings in Appendix B. 2. In the case of a discrepancy, the most recent Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide supersede targets listed in Table 2-1 above. 3. These socket limits are defined in the LGA771 Socket Mechanical Design Guide. 4. These package handling limits are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Shear load that can be applied to the package IHS. 6. Tensile load that can be applied to the package IHS. 7. Torque that can be applied to the package IHS. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 13

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
13
Thermal/Mechanical Reference Design
2
Thermal/Mechanical Reference
Design
This chapter describes the thermal/mechanical reference design for Quad-Core Intel®
Xeon® Processor 5300 Series. Quad-Core Intel® Xeon® Processor X5300 Series is the
performance-optimized processor with a front side bus speed of 1066 MHz or
1333 MHz. Quad-Core Intel® Xeon® Processor E5300 Series is a rack-optimized
processor with a front side bus speed of 1066 MHz or 1333 MHz. Both Quad-Core
Intel® Xeon® Processor X5300 Series and Quad-Core Intel® Xeon® Processor E5300
Series are targeted for the full range of form factors (2U, 2U+ and 1U/volumetrically
constrained). The Quad-Core Intel® Xeon® Processor L5300 Series is a
power-optimized processor with a front side bus speed of 1066 MHz or 1333 MHz. The
Quad-Core Intel® Xeon® Processor L5300 Series is targeted for volumetrically
constrained form factors (1U, server blades and embedded servers).
2.1
Mechanical Requirements
The mechanical performance of the processor cooling solution must satisfy the
requirements described in this section.
2.1.1
Processor Mechanical Parameters
Notes:
1.
Refer to drawings in
Appendix B
.
2.
In the case of a discrepancy, the most recent
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
and
LGA771 Socket Mechanical Design Guide
supersede targets listed in
Table 2-1
above.
3.
These socket limits are defined in the
LGA771 Socket Mechanical Design Guide
.
4.
These package handling limits are defined in the
Quad-Core Intel® Xeon® Processor 5300 Series
Datasheet.
5.
Shear load that can be applied to the package IHS.
6.
Tensile load that can be applied to the package IHS.
7.
Torque that can be applied to the package IHS.
Table 2-1.
Processor Mechanical Parameters Table
Parameter
Minimum
Maximum
Unit
Notes
Volumetric Requirements
and Keepouts
1
Static Compressive Load
3
Static Board Deflection
3
Dynamic Compressive Load
3
Transient Bend
3
Shear Load
70
311
lbf
N
2,4,5
Tensile Load
25
111
lbf
N
2,4,6
Torsion Load
35
3.95
in*lbf
N*m
2,4,7