Intel X5365 Design Guide - Page 39
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Thermal/Mechanical Reference Design 2.4.3 Summary In summary, considerations in heatsink design include: • The local ambient temperature TLA at the heatsink, airflow (CFM), the power being dissipated by the processor, and the corresponding maximum TCASE. These parameters are usually combined in a single lump cooling performance parameter, ΨCA (case to air thermal characterization parameter). More information on the definition and the use of ΨCA is given in Section 2.4 and Section 2.3.2. • Heatsink interface (to IHS) surface characteristics, including flatness and roughness. • The performance of the TIM used between the heatsink and the IHS. • Surface area of the heatsink. • Heatsink material and technology. • Development of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system. • Integrated package/socket stackup height information is provided in the LGA771 Socket Mechanical Design Guide. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 39
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