HP 610 Compaq 615 Notebook PC and Compaq 610 Notebook PC - Maintenance and Ser - Page 90
Thermal pads are used on the Northbridge chip
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Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed: ■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. Replacement thermal material is included with all system board, heat sink, and processor spare part kits. Reverse this procedure to install the heat sink. Maintenance and Service Guide 4-47
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Removal and replacement procedures
Maintenance and Service Guide
4–47
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time
the heat sink is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
Replacement thermal material is included with all system board, heat sink, and processor spare part kits.
Reverse this procedure to install the heat sink.