Intel S875WP1 Product Guide - Page 46

and apply the thermal interface material to the top of the processor.

Page 46 highlights

✏ NOTE The bottom of the heat sink may have thermal interface material (TIM) already applied. Be careful not to damage the thermal interface material. 5. If there is no thermal interface material on the bottom of the heat sink, use the enclosed syringe and apply the thermal interface material to the top of the processor. 6. Place the fan heat sink on top of the processor. TP00208 Figure 12. Attaching the Heat Sink to the Processor 46 Intel Server Board S875WP1-E Product Guide

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46
Intel Server Board S875WP1-E Product Guide
NOTE
The bottom of the heat sink may have thermal interface material (TIM)
already applied.
Be careful not to damage the thermal interface material.
5.
If there is no thermal interface material on the bottom of the heat sink, use the enclosed syringe
and apply the thermal interface material to the top of the processor.
6.
Place the fan heat sink on top of the processor.
TP00208
Figure 12. Attaching the Heat Sink to the Processor