HP G32-200 Compaq Presario CQ32 Notebook PC and HP G32 Notebook PC - Maintenan - Page 93

and processor spare part kits., heat sink assembly is reinstalled.

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4. Remove the fan/heat sink assembly from the system board (2). The thermal material must be thoroughly cleaned from the affected surfaces on the system board (1), (3) and from the affected surfaces on the fan/heat sink assembly (2), (4) each time the fan/heat sink assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/ heat sink assembly is reinstalled. NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board, and processor spare part kits. The following illustration shows the locations for thermal material. Reverse this procedure to install the fan/heat sink assembly. Component replacement procedures 83

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4.
Remove the fan/heat sink assembly from the system board
(2)
.
The thermal material must be thoroughly cleaned from the affected surfaces on the system board
(1)
,
(3)
and from the affected surfaces on the fan/heat sink assembly
(2)
,
(4)
each time the fan/heat sink
assembly is removed. Thermal pads and thermal paste must be installed on all surfaces before the fan/
heat sink assembly is reinstalled.
NOTE:
Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,
and processor spare part kits.
The following illustration shows the locations for thermal material.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
83