HP Pavilion dm4-3000 HP Pavilion dm4 Entertainment PC - Maintenance and Servic - Page 89

Thermal pads are used on the system board capacitors

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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board components each time the fan/heat sink assembly is removed. Replacement thermal material is included with the fan/heat sink assembly and system board spare part kits. The following illustration shows the replacement thermal material locations. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it. This applies only to computer models equipped with a graphics subsystem with discrete memory. ● Thermal pads are used on the system board capacitors (5) and the heat sink sections (6) that service them Reverse this procedure to install the fan/heat sink assembly. Component replacement procedures 81

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NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly and system board spare
part kits. The following illustration shows the replacement thermal material locations.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
Thermal paste is used on the graphics subsystem chip
(3)
and the heat sink section
(4)
that
services it. This applies only to computer models equipped with a graphics subsystem with
discrete memory.
●
Thermal pads are used on the system board capacitors
(5)
and the heat sink sections
(6)
that
service them
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
81