HP Pavilion g4-1000 HP G4 Notebook PC - Maintenance and Service Guide - Page 78

enclosure each time the system board is removed. Replacement thermal material is included

Page 78 highlights

6. Remove the system board (3) by sliding it up and to the right at an angle. NOTE: System boards for use with computer models equipped with an AMD processor have the Southbridge chip located on the bottom of the board. A thermal pad is used on the Southbridge chip (1) and the base enclosure heat sink (2) that services it. The thermal material must be thoroughly cleaned from the surfaces of the system board and the heat sink attached to the base enclosure each time the system board is removed. Replacement thermal material is included with all base enclosure and system board spare part kits. Reverse this procedure to install the system board. 70 Chapter 4 Removal and replacement procedures

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6.
Remove the system board
(3)
by sliding it up and to the right at an angle.
NOTE:
System boards for use with computer models equipped with an AMD processor have the
Southbridge chip located on the bottom of the board. A thermal pad is used on the Southbridge
chip
(1)
and the base enclosure heat sink
(2)
that services it. The thermal material must be
thoroughly cleaned from the surfaces of the system board and the heat sink attached to the base
enclosure each time the system board is removed. Replacement thermal material is included with
all base enclosure and system board spare part kits.
Reverse this procedure to install the system board.
70
Chapter 4
Removal and replacement procedures