HP Pavilion g4-1000 HP G4 Notebook PC - Maintenance and Service Guide - Page 82

Remove the fan and heat sink, and the heat sink

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Remove the fan and heat sink: 1. Turn the system board upside down, with the front toward you. NOTE: Steps 2 through 4 apply to computer models equipped with an AMD processor. See steps 5 through 7 for heat sink removal information for computer models equipped with an Intel processor. 2. Disconnect the fan cable (1) from the system board. 3. Remove the three Phillips PM2.5×5.0 screws (2) and the three Phillips PM2.5×10.0 spring-loaded screws (3) that secure the heat sink to the system board. NOTE: Due to the adhesive quality of the thermal material located between the heat sink and system board components, it may be necessary to move the heat sink from side to side to detach it. 4. Remove the fan and heat sink (4). NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board components each time the heat sink is removed. Replacement thermal material is included with the base enclosure, heat sink, processor, and system board spare part kits. ● Thermal paste is used on the processor (1) and the heat sink section (2) that services it ● A thermal pad is used on the Northbridge chip (3) and the heat sink section (4) that services it ● A thermal pad is used on the graphics subsystem chip (5) and the heat sink section (6) that services it (only on computer models equipped with a graphics subsystem with discrete memory) 74 Chapter 4 Removal and replacement procedures

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Remove the fan and heat sink:
1.
Turn the system board upside down, with the front toward you.
NOTE:
Steps 2 through 4 apply to computer models equipped with an AMD processor. See
steps 5 through 7 for heat sink removal information for computer models equipped
with an Intel processor.
2.
Disconnect the fan cable
(1)
from the system board.
3.
Remove the three Phillips PM2.5×5.0 screws
(2)
and the three Phillips PM2.5×10.0 spring-loaded
screws
(3)
that secure the heat sink to the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to detach
it.
4.
Remove the fan and heat sink
(4)
.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material is
included with the base enclosure, heat sink, processor, and system board spare part kits.
●
Thermal paste is used on the processor
(1)
and the heat sink section
(2)
that services it
●
A thermal pad is used on the Northbridge chip
(3)
and the heat sink section
(4)
that services
it
●
A thermal pad is used on the graphics subsystem chip
(5)
and the heat sink section
(6)
that
services it (only on computer models equipped with a graphics subsystem with discrete
memory)
74
Chapter 4
Removal and replacement procedures