Intel Q9400S Data Sheet - Page 21

Datasheet

21

Electrical Specifications

NOTES:

1.

Each processor is programmed with a maximum valid voltage identification value (VID),

which is set at manufacturing and can not be altered. Individual maximum VID values are

calibrated during manufacturing such that two processors at the same frequency may have

different settings within the VID range. Note that this differs from the VID employed by the

processor during a power management event (Thermal Monitor 2, Enhanced Intel

SpeedStep

®

Technology, or Extended HALT State).

2.

Unless otherwise noted, all specifications in this table are based on estimates and

simulations or empirical data. These specifications will be updated with characterized data

from silicon measurements at a later date.

3.

These voltages are targets only. A variable voltage source should exist on systems in the

event that a different voltage is required. See

Section 2.3

and

Table 2-1

for more

information.

4.

The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE

lands at the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe

I

CC

Processor Number

QX9770

3.20 GHz (12 MB Cache)

—

—

140

A

6

Processor Number

QX9650

I

CC

for

775_VR_CONFIG_05B:


—

—

125

A

Processor Number

Q9650

Q9550

Q9550S

Q9505

Q9505S

Q9450

Q9400

Q9400S

Q9300

Q8400

Q8300

Q8200

Q8400S

Q8200S

I

CC

for

775_VR_CONFIG_05A:















—

—

100

100

100

100

100

100

100

100

100

100

100

100

100

100

A

V

TT

FSB termination

voltage

(DC + AC

specifications)

on Intel

®

3 series

Chipset family boards

1.045

1.1

1.155

V

8, 9

on Intel

®

4 series

Chipset family boards

1.14

1.2

1.26

VTT_OUT_LEFT

and

VTT_OUT_RIGHT

I

CC

DC Current that may be drawn from

VTT_OUT_LEFT and VTT_OUT_RIGHT per land

—

—

580

mA

I

TT

I

CC

for V

TT

supply before V

CC

stable

I

CC

for V

TT

supply after V

CC

stable

—

—

8.0

7.0

A

9

I

CC_VCCPLL

I

CC

for PLL land

—

—

260

mA

I

CC_GTLREF

I

CC

for GTLREF

—

—

200

μA

Table 2-3.

Voltage and Current Specifications

Symbol

Parameter

Min

Typ

Max

Unit

Notes

2, 10

Section	Page
Intel® Core™2 Extreme Processor QX9000D Series, Intel® Core™2 Quad Processor Q9000D, Q9000SD, Q8000D, and Q8000SD Series	1
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, Q8000S Series Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology Definitions	12
1.2 References	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
2.4 Reserved, Unused, and TESTHI Signals	18
2.5 Power Segment Identifier (PSID)	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
2.6.2 DC Voltage and Current Specification	20
2.6.3 VCC Overshoot	25
2.6.4 Die Voltage Validation	25
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	26
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	28
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	64
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	98
7.5 Boxed Intel® Core™2 Extreme Processor QX9650 Specifications	99
7.5.1 Boxed Intel® Core™2 Extreme Processor QX9650 Fan Heatsink Weight	100
8 Debug Tools Specifications	103
8.1 Logic Analyzer Interface (LAI)	103
8.1.1 Mechanical Considerations	103

Intel Q9400S Data Sheet - Page 21

Table 2-3., Voltage and Current Specifications - q9400 processor

Page 21 highlights