Intel Q9400S Data Sheet - Page 99

Datasheet

101

Boxed Processor Specifications

If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin

motherboard header and the motherboard is designed with a fan speed controller with

PWM output (CONTROL see

Table 7-1

) and remote thermal diode measurement

capability the boxed processor will operate as follows:

As processor power has increased the required thermal solutions have generated

increasingly more noise. Intel has added an option to the boxed processor that allows

system integrators to have a quieter system in the most common usage.

The 4th wire PWM solution provides better control over chassis acoustics. This is

achieved by more accurate measurement of processor die temperature through the

processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the

use of an ASIC located on the motherboard that sends out a PWM control signal to the

4th pin of the connector labeled as CONTROL. The fan speed is based on actual

processor temperature instead of internal ambient chassis temperatures.

If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard

processor fan header it will default back to a thermistor controlled mode, allowing

compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode,

the fan RPM is automatically varied based on the Tinlet temperature measured by a

thermistor located at the fan inlet.

For more details on specific motherboard requirements for 4-wire based fan speed

control see the appropriate Thermal and Mechanical Design Guidelines (See

Section 1.2

).

7.5

Boxed Intel

®

Core™2 Extreme Processor QX9650

Specifications

This section documents the mechanical specifications of the Boxed Intel

®

Core™2

Extreme processor QX9650. The boxed processor will be shipped with an unattached

fan heatsink.

Figure 7-10

shows a mechanical representation of the boxed processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper

cooling. The physical space requirements and dimensions for the boxed processor with

assembled fan heatsink are shown in

Figure 7-3

(top view), and

Figure 7-4

(side view).

The airspace requirements for the boxed processor fan heatsink must also be

incorporated into new baseboard and system designs. Airspace requirements are

shown in

Figure 7-11

and

Figure 7-12

. Note that some figures have centerlines shown

(marked with alphabetic designations) to clarify relative dimensioning.

Note:

The Boxed Intel

®

Core™2 Extreme processor QX9650 cooling solution violates the

boxed processor keep out zones. This is done intentionally, and with the understanding

that Extreme Edition systems will be integrated into larger capacity chassis.

Section	Page
Intel® Core™2 Extreme Processor QX9000D Series, Intel® Core™2 Quad Processor Q9000D, Q9000SD, Q8000D, and Q8000SD Series	1
Contents	3
Figures	5
Tables	6
Revision History	7
Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000, Q9000S, Q8000, Q8000S Series Features	9
1 Introduction	11
1.1 Terminology	12
1.1.1 Processor Terminology Definitions	12
1.2 References	14
2 Electrical Specifications	15
2.1 Power and Ground Lands	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	15
2.2.2 Vtt Decoupling	15
2.2.3 FSB Decoupling	16
2.3 Voltage Identification	16
2.4 Reserved, Unused, and TESTHI Signals	18
2.5 Power Segment Identifier (PSID)	18
2.6 Voltage and Current Specification	19
2.6.1 Absolute Maximum and Minimum Ratings	19
2.6.2 DC Voltage and Current Specification	20
2.6.3 VCC Overshoot	25
2.6.4 Die Voltage Validation	25
2.7 Signaling Specifications	26
2.7.1 FSB Signal Groups	26
2.7.2 CMOS and Open Drain Signals	28
2.7.3 Processor DC Specifications	28
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications	29
2.7.3.2 GTL+ Front Side Bus Specifications	30
2.8 Clock Specifications	31
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	31
2.8.2 FSB Frequency Select Signals (BSEL[2:0])	32
2.8.3 Phase Lock Loop (PLL) and Filter	32
2.8.4 BCLK[1:0] Specifications	32
3 Package Mechanical Specifications	35
3.1 Package Mechanical Drawing	35
3.2 Processor Component Keep-Out Zones	39
3.3 Package Loading Specifications	39
3.4 Package Handling Guidelines	39
3.5 Package Insertion Specifications	40
3.6 Processor Mass Specification	40
3.7 Processor Materials	40
3.8 Processor Markings	40
4 Land Listing and Signal Descriptions	43
4.1 Processor Land Assignments	43
4.2 Alphabetical Signals Reference	64
5 Thermal Specifications and Design Considerations	75
5.1 Processor Thermal Specifications	75
5.1.1 Thermal Specifications	75
5.1.2 Thermal Metrology	81
5.2 Processor Thermal Features	81
5.2.1 Thermal Monitor	81
5.2.2 Thermal Monitor 2	82
5.2.3 On-Demand Mode	83
5.2.4 PROCHOT# Signal	84
5.2.5 THERMTRIP# Signal	84
5.3 Platform Environment Control Interface (PECI)	85
5.3.1 Introduction	85
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems	85
5.3.2 PECI Specifications	86
5.3.2.1 PECI Device Address	86
5.3.2.2 PECI Command Support	86
5.3.2.3 PECI Fault Handling Requirements	86
5.3.2.4 PECI GetTemp0() Error Code Support	86
6 Features	87
6.1 Power-On Configuration Options	87
6.2 Clock Control and Low Power States	87
6.2.1 Normal State	88
6.2.2 HALT and Extended HALT Powerdown States	88
6.2.2.1 HALT Powerdown State	88
6.2.2.2 Extended HALT Powerdown State	89
6.2.3 Stop Grant and Extended Stop Grant States	89
6.2.3.1 Stop-Grant State	89
6.2.3.2 Extended Stop Grant State	90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State	90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State	90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State	90
6.2.5 Sleep State	90
6.2.6 Deep Sleep State	91
6.2.7 Deeper Sleep State	91
6.2.8 Enhanced Intel SpeedStep® Technology	92
6.3 Processor Power Status Indicator (PSI) Signal	92
7 Boxed Processor Specifications	93
7.1 Introduction	93
7.2 Mechanical Specifications	94
7.2.1 Boxed Processor Cooling Solution Dimensions	94
7.2.2 Boxed Processor Fan Heatsink Weight	95
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	95
7.3 Electrical Requirements	95
7.3.1 Fan Heatsink Power Supply	95
7.4 Thermal Specifications	97
7.4.1 Boxed Processor Cooling Requirements	97
7.4.2 Variable Speed Fan	98
7.5 Boxed Intel® Core™2 Extreme Processor QX9650 Specifications	99
7.5.1 Boxed Intel® Core™2 Extreme Processor QX9650 Fan Heatsink Weight	100
8 Debug Tools Specifications	103
8.1 Logic Analyzer Interface (LAI)	103
8.1.1 Mechanical Considerations	103

Intel Q9400S Data Sheet - Page 99

Boxed Intel, Core™2 Extreme Processor QX9650, Specifications

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