Samsung SCX4521F Service Manual - Page 12

Reference Information 11.2 Acronyms and Abbreviations(1) The table below explains the abbreviations and acronyms used in this service manual. Where abbreviations or acronyms are used in the text please refer to this table. Abbreviations AP AC APC ASIC ASSY BIOS BLDC CMOS CN CON CPU dB dbA dBM DC DCU DPI DRAM DVM ECP EDC EEPROM EMI EP EPP FPOT F/W GDI GND HBP HDD H/H HV HVPS I/F I/O IC IDE Explanation Access Point Alternating Current Auto Power Control Application Specific Integrated Circuit assembly Basic Input Output System Brush-less Direct Current Complementary Metal Oxide Semiconductor connector connector Central Processing Unit decibel decibel A decibel milliwatt direct current Diagnostic Control Unit Dot Per Inch Dynamic Random Access Memory Digital Voltmeter Enhanced Capability Port Embedded Diagnostic control Electronically Erasable Programmable Read Only Memory Electro Magnetic Interference electrophotographic Enhanced Parallel Port First Printout Time firmware graphics device interface ground Host Based Printing Hard Disk Drive High temperature and high marshy place high voltage High Voltage Power Supply interface Input and Output integrated circuit Intelligent Drive electronics or Imbedded Drive Electronics 11-2 Service Manual Samsung Electronics