IBM 8478 Hardware Maintenance Manual - Page 68

procedures

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CAUTION: When laser products (such as CD-ROMs, DVD drives, fiber optic devices, or transmitters) are installed, note the following: v Do not remove the covers. Removing the covers of the laser product could result in exposure to hazardous laser radiation. There are no serviceable parts inside the device. v Use of controls or adjustments or performance of procedures other than those specified herein might result in hazardous radiation exposure. DANGER: Some laser products contain an embedded Class 3A or Class 3B laser diode. Note the following. Laser radiation when open. Do not stare into the beam, do not view directly with optical instruments, and avoid direct exposure to the beam. 5. Touch the static-protective bag containing the drive to any unpainted metal surface on the server; then, remove the drive from the bag and place it on a static-protective surface. 6. Set any jumpers or switches on the drive according to the documentation that comes with the drive. 7. Install the drive. v If you are installing a 5.25-in drive in bay 2, push the drive into the bay; then, use the two screws to attach the drive to the drive cage. v If you are installing a 3.5-in drive in bay 2, you must attach the 5.25-in conversion kit, supplied with your option, to the 3.5-in drive. Note: You can only install a 3.5-in device in bay 4. 8. Cable the drive. v If the drive is an IDE device, plug one connector of the IDE signal cable into the back of the drive and the other end of the cable into the IDE connector (IDE1) on the system board. For the location of the IDE connectors, see "System board internal cable connectors" on page 42. v If the drive is a SCSI device, plug one connector of the SCSI signal cable into the back of the drive and the other end of the cable into the SCSI adapter. See "Installing an adapter" on page 51. 58 Hardware Maintenance Manual: xSeries 200

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CAUTION:
When
laser
products
(such
as
CD-ROMs,
DVD
drives,
fiber
optic
devices,
or
transmitters)
are
installed,
note
the
following:
v
Do
not
remove
the
covers.
Removing
the
covers
of
the
laser
product
could
result
in
exposure
to
hazardous
laser
radiation.
There
are
no
serviceable
parts
inside
the
device.
v
Use
of
controls
or
adjustments
or
performance
of
procedures
other
than
those
specified
herein
might
result
in
hazardous
radiation
exposure.
DANGER:
Some
laser
products
contain
an
embedded
Class
3A
or
Class
3B
laser
diode.
Note
the
following.
Laser
radiation
when
open.
Do
not
stare
into
the
beam,
do
not
view
directly
with
optical
instruments,
and
avoid
direct
exposure
to
the
beam.
5.
Touch
the
static-protective
bag
containing
the
drive
to
any
unpainted
metal
surface
on
the
server;
then,
remove
the
drive
from
the
bag
and
place
it
on
a
static-protective
surface.
6.
Set
any
jumpers
or
switches
on
the
drive
according
to
the
documentation
that
comes
with
the
drive.
7.
Install
the
drive.
v
If
you
are
installing
a
5.25-in
drive
in
bay
2,
push
the
drive
into
the
bay;
then,
use
the
two
screws
to
attach
the
drive
to
the
drive
cage.
v
If
you
are
installing
a
3.5-in
drive
in
bay
2,
you
must
attach
the
5.25-in
conversion
kit,
supplied
with
your
option,
to
the
3.5-in
drive.
Note:
You
can
only
install
a
3.5-in
device
in
bay
4.
8.
Cable
the
drive.
v
If
the
drive
is
an
IDE
device,
plug
one
connector
of
the
IDE
signal
cable
into
the
back
of
the
drive
and
the
other
end
of
the
cable
into
the
IDE
connector
(IDE1)
on
the
system
board.
For
the
location
of
the
IDE
connectors,
see
“System
board
internal
cable
connectors”
on
page
42.
v
If
the
drive
is
a
SCSI
device,
plug
one
connector
of
the
SCSI
signal
cable
into
the
back
of
the
drive
and
the
other
end
of
the
cable
into
the
SCSI
adapter.
See
“Installing
an
adapter”
on
page
51.
58
Hardware
Maintenance
Manual:
xSeries
200