Intel SE7505VB2 Product Specification - Page 45
Hardware Monitoring, Monitored Components - power supply
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Intel® Server Board SE7505VB2 Hardware Monitoring 6. Hardware Monitoring 6.1 Monitored Components The Intel Server Board SE7505VB2 has an integrated Winbond* Heceta chip that is responsible for hardware monitoring. The Winbond Heceta chip provides basic server hardware monitoring which alerts a system administrator if a hardware problem occurs on the board. The retail boxed board ships with a copy of LANDesk* Client Manager, which can monitor the management bus for these alerts and help administrators identify a problem on the board. Below is a table of monitored headers and sensors on the board. Table 18. Monitored Components Voltage Item Vcpu 1.8V 3.3V 5V SB3V ENG12V 2.5V Vbat SB5V Fan Speed PWM1 Temperature TACH1 TACH2 TACH3 TACH4 TACH5 TACH6 CPU0 CPU1 Ambient Monitors processor voltage Description Monitors +1.8V Monitors +3.3V Monitors 5VSB (Internal) Monitors +12Vin Monitors -12Vin (should be same as 12V @ Power-Supply) Monitors -5V Monitors battery voltage Monitors 5VSB Controls system fans CPU fans (invariable speed) Monitors system fan 1 (front) Monitors system fan 2 (front) Monitors system fan 4 (rear) Monitors system fan 3 (rear) Monitors CPU fan 2 Monitors CPU fan 1 Monitors primary processor temperature Monitors secondary processor temperature Monitors Ambient temperature (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) (sIO) The LANDesk Client Manager software and a white paper that provides more information on using LDCM are available on the Intel Server Board SE7505VB2 Resource CD. Revision 1.2 45 Intel part number C32194-002