Home » HP Manuals » Desktops » HP Dc5000 » Manual Viewer

HP Dc5000 HP Compaq Business Desktop dc5000 Series Service Reference Guide 2nd - Page 114

Front I/O Devices, Preparation for Disassembly, Power Supply

UPC - 829160313740

Add to My Manuals
Save this manual to your list of manuals

Page 114 highlights

Removal and Replacement Procedures- Small Form Factor (SFF) Chassis 7.9 Front I/O Devices 1. Prepare the computer for disassembly (Section 7.1, "Preparation for Disassembly"). 2. Disconnect the two I/O device cables from the system board: the front USB cable pair and the front audio cable. 3. Remove the power supply from the chassis (Section 7.16, "Power Supply"). 4. From the inside of the chassis, remove the two screws that secure the I/O device to the chassis 1, then pull the device into the chassis 2 to free it from its mount. To install the housing assembly, reverse the removal procedures. 7-20 360201-002 Service Reference Guide, dc5000

Section	Page
Contents	5
Installing the Operating System	9
1.0.1 Installing or Upgrading Device Drivers	9
1.0.2 Creating a Bootable Diskette or USB Flash Media Device	9
1.1 HP Software	10
Setup Utilities and Diagnostics Features	11
2.1 Power-On Self-Test (POST)	11
2.2 Computer Setup Utilities	12
2.2.1 Using Computer Setup (F10) Utilities	13
2.2.2 Computer Setup Menu	14
2.3 Diagnostics for Windows	22
2.3.1 Detecting Diagnostics for Windows	22
2.3.2 Installing Diagnostics for Windows	23
2.3.3 Using Categories in Diagnostics for Windows	23
Menu Bar-File, Categories, Navigation, Level, Tab, Help	24
2.3.4 Running Diagnostic Tests in Diagnostics for Windows	25
2.4 Configuration Record	26
2.4.1 Installing Configuration Record	26
2.4.2 Running Configuration Record	26
2.5 Remote Diagnostics Enabling Agent	27
2.5.1 Installing or Upgrading Remote Diagnostics Enabling Agent	27
2.5.2 Running the Remote Diagnostics Enabling Agent	27
2.6 Protecting the Software	27
2.7 Restoring the Software	28
Desktop Management	29
3.1 Initial Configuration and Deployment	29
3.2 Remote System Installation	30
3.3 Software Updating and Management	30
3.3.1 HP Client Manager Software	30
3.3.2 Altiris Client Management Solutions	30
3.3.3 System Software Manager	31
3.3.4 Proactive Change Notification (PCN)	31
3.3.5 Subscriber’s Choice	32
3.4 ROM Flash	32
3.4.1 Remote ROM Flash	32
3.4.2 HPQ Flash	32
3.4.3 FailSafe Boot Block ROM	33
3.4.4 Replicating the Setup	34
3.4.5 Dual-State Power Button	34
3.4.6 Power Management	35
3.4.7 World Wide Web Site	35
3.4.8 Building Blocks and Partners	35
3.5 Asset Tracking and Security	36
3.5.1 Password Security	38
3.5.2 Establishing a Setup Password Using Computer Setup	38
3.5.3 Establishing a Power-On Password Using Computer Setup	38
Entering a Power-On Password	39
Entering a Setup Password	39
Changing a Power-On or Setup Password	39
Deleting a Power-On or Setup Password	40
National Keyboard Delimiter Characters	41
Clearing Passwords	41
3.5.4 DriveLock	42
Using DriveLock	43
DriveLock Applications	43
3.5.5 Master Boot Record Security	44
3.5.6 Before You Partition or Format the Current Bootable Disk	45
3.5.7 Cable Lock Provision	45
3.5.8 Fingerprint Identification Technology	46
3.6 Fault Notification and Recovery	46
3.6.1 Drive Protection System	46
3.6.2 Surge-Tolerant Power Supply	46
3.6.3 Thermal Sensor	46
Ultra ATA Drive Guidelines and Features	47
4.1 Ultra ATA Jumpers	47
4.2 Ultra ATA Cables	47
4.2.1 Cable Layout	47
Single-Drive Cable	48
Two-Drive Cable	48
4.3 Drive Installation Guidelines	48
4.3.1 Device Classes	49
General Attach Guidelines	49
4.3.2 Attach Sequence Rules by Class Priority	49
4.3.3 Attach Sequence Worksheet	50
Example 1: Three Device Installation Sample	51
Example 2: Four Device Installation Sample	51
4.3.4 Additional Drive Application Notes	52
4.4 SMART	52
4.5 Drive Capacities	53
Identifying the Chassis, Routine Care, and Disassembly Preparation	55
5.1 Chassis Designations	55
5.1.1 Microtower (µT)	55
5.1.2 Small Form Factor (SFF)	56
5.2 Electrostatic Discharge Information	57
5.2.1 Generating Static	57
5.2.2 Preventing Electrostatic Damage to Equipment	57
5.2.3 Personal Grounding Methods and Equipment	58
5.2.4 Grounding the Work Area	58
5.2.5 Recommended Materials and Equipment	58
5.3 Routine Care	59
5.3.1 General Cleaning Safety Precautions	59
5.3.2 Cleaning the Computer Case	59
5.3.3 Cleaning the Keyboard	60
5.3.4 Cleaning the Monitor	60
5.3.5 Cleaning the Mouse	60
5.4 Service Considerations	61
5.4.1 Power Supply Fan	61
5.4.2 Tools and Software Requirements	61
5.4.3 Screws	61
5.4.4 Cables and Connectors	62
5.4.5 Hard Drives	62
5.4.6 Lithium Coin Cell Battery	62
Removal and Replacement Procedures- Microtower (µT) Chassis	63
6.1 Preparation for Disassembly	63
6.2 External Security Devices	64
6.2.1 Installing a Cable Lock	64
6.2.2 Installing a Padlock	65
6.3 Access Panel	66
6.4 Front Bezel	67
6.5 Front Drive Bezels	70
6.5.1 5.25\	70
6.5.2 Diskette Drive Bezel	71
6.5.3 3.5\	71
6.6 Memory Modules	72
6.7 Expansion Cards	73
6.7.1 Expansion Slot Cover	73
6.7.2 PCI Expansion Card	74
6.8 Drives	76
6.8.1 Drive Positions	76
6.8.2 Removing a Drive	77
Disconnecting Optical Drive Cables	77
Disconnecting Diskette Drive Cables	77
Disconnecting Hard Drive Cables	78
Releasing the Drives	78
6.8.3 Installing a Drive	79
Connecting Optical Drive Cables	80
Connecting Diskette Drive Cables	80
Connecting Hard Drive Cables	81
6.9 Chassis Fan	82
6.10 Front I/O Panel Housing Assembly	83
6.11 Front I/O Devices	84
6.12 Power Switch Assembly	85
6.13 Processor and Heatsink	87
6.14 System Board	88
6.15 Battery	89
6.15.1 Type 1 Battery Holder	90
6.15.2 Type 2 Battery Holder	91
6.15.3 Type 3 Battery Holder	92
6.16 Speaker	93
6.17 Power Supply	94
Removal and Replacement Procedures- Small Form Factor (SFF) Chassis	95
7.1 Preparation for Disassembly	95
7.2 External Security Devices	96
7.2.1 Cable Lock	96
7.2.2 Padlock	97
7.3 Computer Access Panel	98
7.4 Front Bezel	99
7.5 Front Drive Bezels	100
7.6 Memory Modules	101
7.7 PCI Expansion Card	102
7.8 Drives	105
7.8.1 Drive Positions	105
7.8.2 Cable Routing	106
7.8.3 Optical Drive	107
7.8.4 External 3.5-inch Drive	110
7.8.5 Primary Hard Drive	112
7.9 Front I/O Devices	114
7.10 Power Switch Assembly	115
7.11 System Board	116
7.12 Chassis Fan	117
7.13 Battery	118
7.13.1 Type 1 Battery Holder	119
7.13.2 Type 2 Battery Holder	120
7.14 Processor and Heatsink	121
7.15 Speaker	122
7.16 Power Supply	123
Connector Pin Assignments	125
Power Cord Set Requirements	131
POST Error Messages	133
Troubleshooting Without Diagnostics	141
System Board and Riser Board Reference Designators	169
Memory	171