HP 5310m HP ProBook 5310m Notebook PC - Maintenance and Service Guide - Page 73
Replacement thermal material is included with all system board and heat sink spare part kits.
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Removal and replacement procedures ✎ The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board each time the heat sink is removed: ❏ Thermal paste is used on the processor 1 and the heat sink section 2 that services it. ❏ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it. Replacement thermal material is included with all system board and heat sink spare part kits. 5. Lift the fan straight up to remove it from the heat sink. (The fan is attached to the heat sink with double-sided tape.) Reverse this procedure to install the fan and heat sink. Maintenance and Service Guide 4-37
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Removal and replacement procedures
Maintenance and Service Guide
4–37
✎
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system board
each time the heat sink is removed:
❏
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
❏
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
Replacement thermal material is included with all system board and heat sink spare part kits.
5. Lift the fan straight up to remove it from the heat sink. (The fan is attached to the heat sink with
double-sided tape.)
Reverse this procedure to install the fan and heat sink.