Dell FC4500 Reference Guide - Page 106

DPE Disk-Array Processor Enclosure, DAE Disk-Array Enclosure

Page 106 highlights

Index adding 3-30 description 1-11 installing 3-32 replacing 3-30 memory modules installing 3-24 removing 3-24 power issues 3-4 power supply adding 3-36 replacing 3-36 power supply, description 1-13 SP adding 3-26 installing 3-27 SP fan pack description 1-14 replacing 3-36 SP, description 1-9 SPS g-5 storing 3-4 technical specifications A-1 current draw, DPE A-1 D DAE (Disk-Array Enclosure) configurations 1-17 defined 1-2, g-1 high-availability 1-17 depth, DPE A-2 DIMM (dual in-line memory module), See memory module, SP memory module disk drive, specifications A-3 disk module adding 3-9 binding 2-18 defined g-2 description 1-12 drive specifications A-3 drive spin-up sequence 3-3 filler, removing 3-10 replacing 3-9 specifications A-3 status lights 1-8, 3-3 DPE (Disk-Array Processor Enclosure) about 1-17 ac power requirements A-1 addressing requirements 2-2 cabling requirements 2-2 components 1-3, 1-4 configurations 1-17 defined g-2 depth A-2 description 1-4 disk module, See disk module 1-12 drive fan pack description 1-14 removing 2-11 drive fan pack, See drive fan pack 1-15 enclosure front panel 1-8 midplane 1-8 fillers 1-4 front door, description 1-9 front panel, description 1-8 height A-2 high availability features 1-4 installing in cabinet 2-3 LCC, description 1-11 monitoring status 3-1 operating limits A-5 optical cables, attaching 2-14 power requirements 2-1 power supply, description 1-13 powering down 3-5, 3-39 powering up 3-44 power-up and initialization sequence 2-16 securing to cabinet 2-6 size A-2 SP fan pack description 1-14 replacing 3-14 status light 3-2 standards certification/compliance A-3 status lights 1-8, 3-2 drive fan pack Check 3-3 technical specifications A-1 weight A-2 width A-2 drive fan pack description 1-14 installing 3-35 removing 2-11 i-2 EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference

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EMC Fibre Channel Disk-Array Processor Enclosure (DPE) Hardware Reference
i-2
Index
adding
3-30
description
1-11
installing
3-32
replacing
3-30
memory modules
installing
3-24
removing
3-24
power issues
3-4
power supply
adding
3-36
replacing
3-36
power supply, description
1-13
SP
adding
3-26
installing
3-27
SP fan pack
description
1-14
replacing
3-36
SP, description
1-9
SPS
g-5
storing
3-4
technical specifications
A-1
current draw, DPE
A-1
D
DAE (Disk-Array Enclosure)
configurations
1-17
defined
1-2, g-1
high-availability
1-17
depth, DPE
A-2
DIMM (dual in-line memory module), See
memory module, SP memory module
disk drive, specifications
A-3
disk module
adding
3-9
binding
2-18
defined
g-2
description
1-12
drive specifications
A-3
drive spin-up sequence
3-3
filler, removing
3-10
replacing
3-9
specifications
A-3
status lights
1-8, 3-3
DPE (Disk-Array Processor Enclosure)
about
1-17
ac power requirements
A-1
addressing requirements
2-2
cabling requirements
2-2
components
1-3, 1-4
configurations
1-17
defined
g-2
depth
A-2
description
1-4
disk module, See disk module
1-12
drive fan pack
description
1-14
removing
2-11
drive fan pack, See drive fan pack
1-15
enclosure
front panel
1-8
midplane
1-8
fillers
1-4
front door, description
1-9
front panel, description
1-8
height
A-2
high availability features
1-4
installing in cabinet
2-3
LCC, description
1-11
monitoring status
3-1
operating limits
A-5
optical cables, attaching
2-14
power requirements
2-1
power supply, description
1-13
powering down
3-5, 3-39
powering up
3-44
power-up and initialization sequence
2-16
securing to cabinet
2-6
size
A-2
SP fan pack
description
1-14
replacing
3-14
status light
3-2
standards certification/compliance
A-3
status lights
1-8, 3-2
drive fan pack Check
3-3
technical specifications
A-1
weight
A-2
width
A-2
drive fan pack
description
1-14
installing
3-35
removing
2-11