HP Dl180 ProLiant DL180 Generation 5 Server Maintenance and Service Guide - Page 49

CAUTION, IMPORTANT, To remove the heat sink

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Figure 30 Removing the air baffle To remove the heat sink: CAUTION: To prevent the heat sink from tilting to one side during installation and removal procedures, use a diagonally opposite pattern (an "X" pattern) when loosening and tightening the four spring-loaded screws. Do not over tighten the heat sink's spring-loaded screws to prevent them from breaking off. A maximum torque of 4 in-Ib is set for the system. 1. Loosen the four mounting pins. 2. Lift the heat sink away from the system board. CAUTION: Place heat sink down in an upright position with the thermal patch facing upward. Do not let the thermal patch touch the work surface. Figure 31 Removing the heat sink assembly IMPORTANT: If the heat sink has been removed for any reason on a previously installed processor, it is critical that you apply more thermal interface material to the integrated heat spreader on the processor to ensure proper thermal bonding between the processor and the heat sink. Removal and replacement procedures 49

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Removal and replacement procedures
49
Figure 30
Removing the air baffle
To remove the heat sink:
CAUTION:
To prevent the heat sink from tilting to one side during installation and removal
procedures, use a diagonally opposite pattern (an “X” pattern) when loosening and tightening the
four spring-loaded screws. Do not over tighten the heat sink’s spring-loaded screws to prevent them
from breaking off. A maximum torque of 4 in-Ib is set for the system.
1.
Loosen the four mounting pins.
2.
Lift the heat sink away from the system board.
CAUTION:
Place heat sink down in an upright position with the thermal patch facing upward. Do
not let the thermal patch touch the work surface.
Figure 31
Removing the heat sink assembly
IMPORTANT:
If the heat sink has been removed for any reason on a previously installed processor, it
is critical that you apply more thermal interface material to the integrated heat spreader on the
processor to ensure proper thermal bonding between the processor and the heat sink.