HP rp7405 User Guide, Third Edition - hp rp7405/rp7410 Servers - Page 144
Zinc Particle Contamination, Appendix C
View all HP rp7405 manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 144 highlights
Site Preparation Zinc Particle Contamination Zinc Particle Contamination Metallic particulates can be especially harmful around electronic equipment. This type of contamination may enter the data center environment from a variety of sources, including but not limited to raised floor tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners or printer component wear. Because metallic particulates conduct electricity, they have an increased potential for creating short circuits in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of electronic equipment. Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these whiskers are disturbed, they may break off and become airborne, possibly causing failures or operational interruptions. For over 50 years, the electronics industry has been aware of the relatively rare but possible threat posed by metallic particulate contamination. During recent years, a growing concern has developed in computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles. Although this problem is relatively rare, it may be an issue within your computer room. Since metallic contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett-Packard strongly recommends that your site be evaluated for metallic particulate contamination before installation of electronic equipment. 122 Appendix C