Intel E2160 Design Guide - Page 20
System Integration Considerations
UPC - 735858199216
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2.5 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Processor Thermal/Mechanical Information • Surface area of the heatsink. • Heatsink material and technology. • Volume of airflow over the heatsink surface area. • Development of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system. System Integration Considerations Manufacturing with Intel® Components using 775-Land LGA Package and LGA775 Socket documentation provides Best Known Methods for all aspects of LGA775 socket based platforms and systems manufacturing. Of particular interest for package and heatsink installation and removal is the System Assembly module. A video covering system integration is also available. Contact your Intel field sales representative for more information. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 20 October 2007 Order Number: 315279 -003US