Intel E2160 Design Guide - Page 35
PICMG 1.3 Copper Heatsink
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Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figure 11. PICMG 1.3 Copper Heatsink Based on lab test data, the case-to-ambient (ΨCA) performance of heatsink was found to be 0.356 °C/W with 18 CFM of airflow through the heatsink fins. This will allow a maximum TLA of 39 °C and meet the processors Thermal Profile specification as described in the processor datasheet. The estimated performance for additional airflows is shown in Figure 12. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 35
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Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007
TDG
Order Number: 315279 - 003US
35
Intel® Reference Thermal Solution—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
Based on lab test data, the case-to-ambient (
Ψ
CA
) performance of heatsink was found
to be 0.356 °C/W with 18 CFM of airflow through the heatsink fins. This will allow a
maximum T
LA
of 39 °C and meet the processors Thermal Profile specification as
described in the processor datasheet. The estimated performance for additional
airflows is shown in
Figure 12
.
Figure 11.
PICMG 1.3 Copper Heatsink