Intel E2160 Design Guide - Page 46
A.2.3 Board Deflection Limits, Board Deflection Definition
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-LGA775 Socket Heatsink Loading Figure 18. Board Deflection Definition d1 d'1 d2 d'2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref ≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm and d'_BOL - d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm Note: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 46 October 2007 Order Number: 315279 - 003US
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor—LGA775
Socket Heatsink Loading
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
TDG
October 2007
46
Order Number: 315279 - 003US
A.2.3
Board Deflection Limits
Deflection limits for the ATX/μATX form factor are:
d_BOL - d_ref
≥
0.09 mm
and
d_EOL - d_ref
≥
0.15 mm
and
d'_BOL - d'_ref
≥
0.09 mm
and
d_EOL' - d_ref'
≥
0.15 mm
Note:
1.
The heatsink preload must remain within the static load limits defined in the
processor datasheet at all times.
2.
Board deflection should not exceed motherboard manufacturer specifications.
Figure 18.
Board Deflection Definition
d1
d2
d’1
d’2