Intel E2160 Design Guide - Page 33

Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

October 2007

TDG

Order Number: 315279 - 003US

33

Intel® Reference Thermal Solution—Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

5.0

Intel® Reference Thermal Solution

5.1

Thermal Solution Requirements

The thermal performance required for the heatsink is determined by calculating the

case-to-ambient thermal characterization parameter,

Ψ

CA

, as explained in

Section 3.1

.

This is a basic thermal engineering parameter that may be used to evaluate and

compare different thermal solutions in similar boundary conditions. An example of how

Ψ

CA

is calculated for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium®

Dual-Core E2160 Processors for Embedded Applications is shown in

Equation 3

.

Equation 3.

Case-to-Ambient Thermal Characterization Parameter

In this calculation, T

C-MAX

and TDP are taken from the thermal profile specification in

the Intel

®

Core™2 Extreme Processor X6800 and Intel

®

Core™2 Duo Desktop

Processor E6000 Sequence Datasheet. It is important to note that in this calculation,

the T

C-MAX

and TDP are constant, while

Ψ

CA

will vary according to the local ambient

temperature (TLA).

Table 1 shows an example of required thermal characterization parameters for the

thermal solution at various TLAs. This table uses the TC max and TDP from the

datasheets. These numbers are subject to change, and in case of conflict, the

specifications in the processor datasheet supersede the T

C-MAX

and TDP specifications

in this document.

Figure 10

further illustrates the required thermal characterization parameter for the

Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors

for Embedded Applications at various operating ambient temperatures. The thermal

solution design must have a

Ψ

CA

less than the values shown for the given local ambient

temperature.

W

C

W

C

C

W

TDP

C

T

C

T

LA

C

CA

o

o

o

o

o

360

.

0

65

38

4

.

61

)

(

)

(

)

(

max

=

−

=

−

=

Ψ

Table 3.

Thermal Characterization Parameter at various T

LA

's

Intel® Core™2 Duo E6400,

E4300, and Intel® Pentium®

Dual-Core E2160 Processors for

Embedded Applications in the

775-Land Package

Required

Ψ

CA (°C/W) of Thermal Solution at TLA = (°C)

TDP (W)

TC Max (°C)

44.1

40

35

30

65

61.4

0.266

0.329

0.406

0.483

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Intel E2160 Design Guide - Page 33

Intel® Reference Thermal Solution, 5.1 Thermal Solution Requirements

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