Intel E2160 Design Guide - Page 43

Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

October 2007

TDG

Order Number: 315279 -003US

43

Intel® Quiet System Technology (Intel® QST)—Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

6.3

Intel

®

QST Configuration and Tuning

Initial configuration of the Intel QST is the responsibility of the board manufacturer. The

SPI flash should be programmed with the hardware configuration of the motherboard

and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This

initial data is generated using the Intel provided Configuration Tool.

At the system integrator level, the Configuration Tool can be used again but this time to

tune the Intel QST subsystem to reflect the shipping system configuration. In the

tuning process, the Intel QST can be modified to have the proper relationships between

the installed fans and sensors in the shipping system. A Weighting Matrix Utility and

Intel QST Log program are planned to assist in optimizing the fan management and

achieve the acoustic goal.

See your Intel field sales representative for availability of these tools.

6.4

Fan Hub Thermistor and Intel

®

QST

There is no closed loop control between Intel QST and the thermistor, but they can

work in tandem to provide the maximum fan speed reduction. The BTX reference

design includes a thermistor on the fan hub. This Variable Speed Fan curve will

determine the maximum fan speed as a function of the inlet ambient temperature, and

by design, provides a

Ψ

CA

sufficient to meet the thermal profile of the processor. Intel

QST, by measuring the processor Digital thermal sensor, will command the fan to

reduce speed below the VSF curve in response to processor workload. Conversely, if the

processor workload increases, the FSC will command the fan via the PWM duty cycle to

accelerate the fan up to the limit imposed by the VSF curve. Care needs to be taken in

BTX designs to ensure the fan speed at the minimum operating speed provides

sufficient air flow to support the other system components.

Figure 17.

Digital Thermal Sensor and Thermistor

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

Fan Speed

(RPM)

Inlet Temperature (°C)

Full

Speed

30

38

Min.

Operating

Variable Speed Fan

(VSF) Curve

Fan Speed

Operating Range

with FSC

34

Min %

Fan Speed

(% PWM Duty Cycle)

100 %

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Intel E2160 Design Guide - Page 43

Intel® QST Configuration and Tuning, 6.4 Fan Hub Thermistor and Intel® QST, - processor supported motherboard

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