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Intel E2160 Design Guide - Page 34

PICMG 1.3 Form Factor,

UPC - 735858199216

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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Intel® Reference Thermal Solution Figure 10. Thermal Characterization Parameters for Various Operating Conditions 5.2 PICMG 1.3 Form Factor Thermal solution design for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications in the PICMG 1.3 form factor is very challenging. Due to limited volume for the heatsink (mainly in direction of heatsink height) and the available amount of airflow, system designers may have to make some tradeoffs in the system boundary condition requirements (i.e., maximum TLA, acoustic requirements, etc.) in order to meet the processor's thermal requirements. The entire thermal solution from the heatsink design, chassis configuration and airflow source needs to be optimized for server systems in order to obtain the best performing solution. Intel has worked with a third party vendor to enable a heatsink design for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for Embedded Applications for the PICMG 1.3 form factor. This design was optimized for the PICMG 1.3 form factor within the available volume for the thermal solution. The motherboard component keep-ins can be seen in Figure 20 and Figure 20. This solution requires 100% of the airflow to be ducted through the heatsink fins in order to prevent heatsink bypass. It is a copper base and copper fin heatsink that is attached to the motherboard with the use of a backplate. This solution is shown in Figure 11. Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 34 October 2007 Order Number: 315279 - 003US

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Match case Limit results 1 per page

Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor—Intel®

Reference Thermal Solution

Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor

TDG

October 2007

Order Number: 315279 - 003US

5.2

PICMG 1.3 Form Factor

Thermal solution design for the Intel® Core™ 2 Duo E6400, E4300, and Intel®

Pentium® Dual-Core E2160 Processors for Embedded Applications in the PICMG 1.3

form factor is very challenging. Due to limited volume for the heatsink (mainly in

direction of heatsink height) and the available amount of airflow, system designers may

have to make some tradeoffs in the system boundary condition requirements (i.e.,

maximum T

, acoustic requirements, etc.) in order to meet the processor's thermal

requirements. The entire thermal solution from the heatsink design, chassis

configuration and airflow source needs to be optimized for server systems in order to

obtain the best performing solution.

Intel has worked with a third party vendor to enable a heatsink design for the Intel®

Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for

Embedded Applications for the PICMG 1.3 form factor. This design was optimized for

the PICMG 1.3 form factor within the available volume for the thermal solution. The

motherboard component keep-ins can be seen in

Figure 20

and

Figure 20

This solution requires 100% of the airflow to be ducted through the heatsink fins in

order to prevent heatsink bypass. It is a copper base and copper fin heatsink that is

attached to the motherboard with the use of a backplate. This solution is shown in

Figure 11

Figure 10.

Thermal Characterization Parameters for Various Operating Conditions