Intel E2160 Design Guide - Page 45
A.2.2 Motherboard Deflection Metric Definition, Table 4., Board Deflection Configuration Definitions
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LGA775 Socket Heatsink Loading-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor A.2.2 Table 4. This board deflection metric provides guidance for mechanical designs that differ from the reference design for ATX//µATX form factor. Motherboard Deflection Metric Definition Motherboard deflection is measured along either diagonal (refer to Figure 18): d = dmax - (d1 + d2)/2 d' = dmax - (d'1 + d'2)/2 Configurations in which the deflection is measured are defined in the Table 2 below. To measure board deflection, follow industry standard procedures (such as IPC) for board deflection measurement. Height gauges and possibly dial gauges may also be used. Board Deflection Configuration Definitions Configuration Parameter Processor + Socket load plate Heatsink d_ref yes no d_BOL yes yes d_EOL yes yes Note: BOL: Beginning of Life EOL: End of Life Parameter Name BOL deflection, no preload BOL deflection with preload EOL deflection October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 45
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