Intel E2160 Design Guide - Page 5
s, Tables, Intel, Duo E6400, E4300, and Intel, Pentium, Dual-Core E2160 Processor - motherboard
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor Figures 1 Package IHS Load Areas 11 2 Processor Case Temperature Measurement Location 15 3 Example Thermal Profile 16 4 Processor Thermal Characterization Parameter Relationships 22 5 Locations for Measuring Local Ambient Temperature, Active Heatsink 24 6 Locations for Measuring Local Ambient Temperature, Passive Heatsink 25 7 Concept for Clocks under Thermal Monitor Control 28 8 Thermal Monitor 2 Frequency and Voltage Ordering 29 9 TCONTROL for Digital Thermal Sensor 32 10 Thermal Characterization Parameters for Various Operating Conditions 34 11 PICMG 1.3 Copper Heatsink 35 12 PICMG 1.3 Heatsink Performance 36 13 Intel® QST Overview 39 14 PID Controller Fundamentals 40 15 Intel® QST Platform Requirements 41 16 Example Acoustic Fan Speed Control Implementation 42 17 Digital Thermal Sensor and Thermistor 43 18 Board Deflection Definition 46 19 Example: Defining Heatsink Preload Meeting Board Deflection Limit 48 20 PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling Components, Primary Side 54 21 PICMG 1.3 Motherboard Keep-out, Secondary Side 55 Tables 1 Referenced Documents 9 2 Terms Used...9 3 Thermal Characterization Parameter at various TLA's 33 4 Board Deflection Configuration Definitions 45 5 Intel Reference Component PICMG 1.3 Thermal Solution Providers 56 October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 5