Intel E2160 Design Guide - Page 37
Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design, Appendix D
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Intel® Reference Thermal Solution-Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor 5.5 and higher surface temperatures. The system designer needs to account for altitude effects in the overall system thermal design to make sure that the TC requirement for the processor is met at the targeted altitude. Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design Figure 20 and Figure 21 in Appendix D give detailed reference PICMG 1.3 motherboard keep-out information for the reference thermal/mechanical enabling design. These drawings include height restrictions in the enabling component region. October 2007 Order Number: 315279 - 003US Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 37