Intel E2160 Design Guide - Page 29

Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

October 2007

TDG

Order Number: 315279 - 003US

29

Thermal Management Logic and Thermal Monitor Feature—Intel

®

Core

TM

2 Duo E6400, E4300,

and Intel

®

Pentium

®

Dual-Core E2160 Processor

Once the processor has sufficiently cooled, and a minimum activation time has expired,

the operating frequency and voltage transition back to the normal system operating

point. Transition of the VID code will occur first, in order to insure proper operation

once the processor reaches its normal operating frequency. Refer to

Figure 8

for an

illustration of this ordering.

Refer to the datasheet for more information on Thermal Monitor 2.

4.2.4

Operation and Configuration

To maintain compatibility with previous generations of processors, which have no

integrated thermal logic, the Thermal Control Circuit portion of Thermal Monitor is

disabled by default. During the boot process, the BIOS must enable the Thermal

Control Circuit. Thermal Monitor must be enabled to ensure proper processor

operation.

The Thermal Control Circuit feature can be configured and monitored in a number of

ways. OEMs are required to enable the Thermal Control Circuit while using various

registers and outputs to monitor the processor thermal status. The Thermal Control

Circuit is enabled by the BIOS setting a bit in an MSR (model specific register).

Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe

operating temperature without the need for special software drivers or interrupt

handling routines. When the Thermal Control Circuit has been enabled, processor

power consumption will be reduced after the thermal sensor detects a high

temperature, i.e., PROCHOT# assertion. The Thermal Control Circuit and PROCHOT#

transitions to inactive once the temperature has been reduced below the thermal trip

point, although a small time-based hysteresis has been included to prevent multiple

PROCHOT# transitions around the trip point. External hardware can monitor

PROCHOT# and generate an interrupt whenever there is a transition from active-to-

inactive or inactive-to-active. PROCHOT# can also be configured to generate an

Figure 8.

Thermal Monitor 2 Frequency and Voltage Ordering

VID

Frequency

Temperature

T

TM2

f

MAX

f

TM2

VID

VID

TM2

PROCHOT#

Time

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Intel E2160 Design Guide - Page 29

Operation and Configuration, Thermal Monitor 2 Frequency and Voltage Ordering - driver

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