Intel E2160 Design Guide - Page 4
Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design - socket
UPC - 735858199216
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor- 5.4 Altitude ...36 5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design ..........37 6.0 Intel® Quiet System Technology (Intel® QST 38 6.1 Intel® QST Algorithm 38 6.1.1 Output Weighting Matrix 39 6.1.2 Proportional-Integral-Derivative (PID 39 6.2 Board and System Implementation of Intel® QST 41 6.3 Intel® QST Configuration and Tuning 43 6.4 Fan Hub Thermistor and Intel® QST 43 A LGA775 Socket Heatsink Loading 44 A.1 LGA775 Socket Heatsink Considerations 44 A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design ....44 A.3 Heatsink Selection Guidelines 49 B Thermal Interface Management 50 B.1 Bond Line Management 50 B.2 Interface Material Area 50 B.3 Interface Material Performance 50 C Case Temperature Reference Metrology 51 C.1 Objective and Scope 51 D Mechanical Drawings 53 E Intel® Enabled Reference Solution Information 56 Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 4 October 2007 Order Number: 315279 - 003US