Intel E2160 Design Guide - Page 39

Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

October 2007

TDG

Order Number: 315279 -003US

39

Intel® Quiet System Technology (Intel® QST)—Intel

®

Core

TM

2 Duo E6400, E4300, and Intel

®

Pentium

®

Dual-Core E2160 Processor

6.1.1

Output Weighting Matrix

Intel QST provides an Output Weighting Matrix that provides a means for a single

thermal sensor to affect the speed of multiple fans. An example of how the matrix

could be used is if a sensor located next to the memory is sensitive to changes in both

the processor heatsink fan and a second fan in the system. By placing a factor in this

matrix additional the Intel QST could command the processor thermal solution fan and

this second fan to both accelerate a small amount. At the system level these two small

changes can result in a smaller change in acoustics than having a single fan respond to

this sensor.

6.1.2

Proportional-Integral-Derivative (PID)

The use of Proportional-Integral-Derivative (PID) control algorithms allow the

magnitude of fan response to be determined based upon the difference between

current temperature readings and specific temperature targets. A major advantage of a

PID Algorithm is the ability to control the fans to achieve sensor temperatures much

closer to the T

CONTROL

.

Figure 14

is an illustration of the PID fan control algorithm. As illustrated in the figure,

when the actual temperature is below the target temperature, the fan will slow down.

The current FSC devices have a fixed temperature vs. PWM output relationship and

miss this opportunity to achieve additional acoustic benefits. As the actual temperature

starts ramping up and approaches the target temperature, the algorithm will instruct

the fan to speed up gradually, but will not abruptly increase the fan speed to respond to

the condition. It can allow an overshoot over the target temperature for a short period

of time while ramping up the fan to bring the actual temperature to the target

temperature. As a result of its operation, the PID control algorithm can enable an

acoustic-friendly platform.

Figure 13.

Intel® QST Overview

Fan to sensor

Relationship

(Output Weighting Matrix)

Temperature sensing

and response

Calculations

(PID)

Fan Commands

(PID)

Fans

Temperature

Sensors

Intel

®

QST

System Response

PWM

PECI / SST

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Intel E2160 Design Guide - Page 39

Output Weighting Matrix, 6.1.2 Proportional-Integral-Derivative (PID), Fan to sensor - vs pentium d

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