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Intel E2160 Design Guide - Page 24

Locations for Measuring Local Ambient Temperature, Active Heatsink, Drawing Not to Scale

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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor-Thermal Metrology Note: Figure 5. half way between the fan hub and the fan housing. If a variable speed fan is used, it may be useful to add a thermocouple taped to the barrier above the location of the temperature sensor used by the fan to check its speed setting against air temperature. When measuring TA in a chassis with a live motherboard, add-in cards, and other system components, it is likely that the TA measurements will reveal a highly nonuniform temperature distribution across the inlet fan section. For passive heatsinks, thermocouples should be placed approximately 13 mm to 25 mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure 5. The thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard. This placement guideline is meant to minimize the effect of localized hot spots from baseboard components. Testing an active heatsink with a variable speed fan can be done in a thermal chamber to capture the worst-case thermal environment scenarios. Otherwise, when doing a bench top test at room temperature, the fan regulation prevents the heatsink from operating at its maximum capability. To characterize the heatsink capability in the worst-case environment in these conditions, it is then necessary to disable the fan regulation and power the fan directly, based on guidance from the fan supplier. Locations for Measuring Local Ambient Temperature, Active Heatsink Note: Drawing Not to Scale Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor TDG 24 October 2007 Order Number: 315279 - 003US

Section	Page
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor: Thermal Design Guide	1
Contents	3
Figures	5
Tables	5
Revision History	6
1.0 Introduction	7
1.1 Document Goals and Scope	7
1.1.1 Importance of Thermal Management	7
1.1.2 Document Goals	7
1.1.3 Document Scope	7
1.2 References	9
1.3 Definition of Terms	9
2.0 Processor Thermal/Mechanical Information	11
2.1 Mechanical Requirements	11
2.1.1 Processor Package	11
2.1.2 Heatsink Attach	12
2.2 Thermal Requirements	14
2.2.1 Processor Case Temperature	14
2.2.2 Thermal Profile	15
2.2.3 Tcontrol	16
2.3 Heatsink Design Considerations	17
2.3.1 Heatsink Size	17
2.3.2 Heatsink Mass	18
2.3.3 Package IHS Flatness	18
2.3.4 Thermal Interface Material	18
2.4 System Thermal Solution Considerations	19
2.4.1 Chassis Thermal Design Capabilities	19
2.4.2 Improving Chassis Thermal Performance	19
2.4.3 Summary	19
2.5 System Integration Considerations	20
3.0 Thermal Metrology	21
3.1 Characterizing Cooling Performance Requirements	21
3.1.1 Example	22
3.2 Processor Thermal Solution Performance Assessment	23
3.3 Local Ambient Temperature Measurement Guidelines	23
3.4 Processor Case Temperature Measurement Guidelines	25
4.0 Thermal Management Logic and Thermal Monitor Feature	26
4.1 Processor Power Dissipation	26
4.2 Thermal Monitor Implementation	26
4.2.1 PROCHOT# Signal	27
4.2.2 Thermal Control Circuit	27
4.2.3 Thermal Monitor 2	28
4.2.4 Operation and Configuration	29
4.2.5 On-Demand Mode	30
4.2.6 System Considerations	30
4.2.7 Operating System and Application Software Considerations	31
4.2.8 THERMTRIP# Signal	31
4.2.9 Cooling System Failure Warning	31
4.2.10 Digital Thermal Sensor	31
4.2.11 Platform Environmental Control Interface (PECI)	32
5.0 Intel® Reference Thermal Solution	33
5.1 Thermal Solution Requirements	33
5.2 PICMG 1.3 Form Factor	34
5.3 ATX/BTX form factors	36
5.4 Altitude	36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design	37
6.0 Intel® Quiet System Technology (Intel® QST)	38
6.1 Intel® QST Algorithm	38
6.1.1 Output Weighting Matrix	39
6.1.2 Proportional-Integral-Derivative (PID)	39
6.2 Board and System Implementation of Intel® QST	41
6.3 Intel® QST Configuration and Tuning	43
6.4 Fan Hub Thermistor and Intel® QST	43
Appendix A LGA775 Socket Heatsink Loading	44
A.1 LGA775 Socket Heatsink Considerations	44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design	44
A.2.1 Heatsink Preload Requirement Limitations	44
A.2.2 Motherboard Deflection Metric Definition	45
A.2.3 Board Deflection Limits	46
A.2.4 Board Deflection Metric Implementation Example	47
A.2.5 Additional Considerations	48
A.3 Heatsink Selection Guidelines	49
Appendix B Thermal Interface Management	50
B.1 Bond Line Management	50
B.2 Interface Material Area	50
B.3 Interface Material Performance	50
Appendix C Case Temperature Reference Metrology	51
C.1 Objective and Scope	51
Appendix D Mechanical Drawings	52

Match case Limit results 1 per page

Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor—Thermal

Metrology

Intel

Core

2 Duo E6400, E4300, and Intel

Pentium

Dual-Core E2160 Processor

TDG

October 2007

Order Number: 315279 - 003US

half way between the fan hub and the fan housing. If a variable speed fan is used, it

may be useful to add a thermocouple taped to the barrier above the location of the

temperature sensor used by the fan to check its speed setting against air temperature.

When measuring TA in a chassis with a live motherboard, add-in cards, and other

system components, it is likely that the TA measurements will reveal a highly non-

uniform temperature distribution across the inlet fan section.

For passive heatsinks, thermocouples should be placed approximately 13 mm to 25

mm [0.5 to 1.0 in] away from processor and heatsink as shown in

Figure 5

. The

thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard.

This placement guideline is meant to minimize the effect of localized hot spots from

baseboard components.

Note:

Testing an active heatsink with a variable speed fan can be done in a thermal chamber

to capture the worst-case thermal environment scenarios. Otherwise, when doing a

bench top test at room temperature, the fan regulation prevents the heatsink from

operating at its maximum capability. To characterize the heatsink capability in the

worst-case environment in these conditions, it is then necessary to disable the fan

regulation and power the fan directly, based on guidance from the fan supplier.

Note:

Drawing Not to Scale

Figure 5.

Locations for Measuring Local Ambient Temperature, Active Heatsink