Canon BJC 6000 Service Manual - Page 93

Bubble Jet Nozzle part, 2.3 Construction of the bubble jet head unit

Page 93 highlights

BJC-6000 Part 4: Technical Reference 3.2.3 Construction of the bubble jet head unit a) Bubble jet nozzle Ink absorbed in the ink sponge will be filtered through the mesh ink filter, then fed to the bubble jet nozzles via ink pipes. When the head drive current passes through a heater board in a nozzle, the ink will boil, producing bubbles. These small bubbles eventually coalesce into one large bubble. The head drive current will be turned off before the ink drop is discharged from the nozzle, but the after-heat of the heater causes the bubble to grow larger and be discharged from the nozzle tip as an ink drop. The nozzle is replenished with ink after the ink has been ejected. NOTE The print head uses semiconductor technology, in which the heaters and I/C circuits are mounted on a silicon plate. This silicon plate with electrical circuitry is bonded to an aluminum base which is then attached to a molded plastic cover with nozzles. Signal Circuit Print Circuit Board Ultra-thin Wire Connection Wire Connection Protective Bond Silicon Plate Aluminum Plate Heater Plate Bubble Jet Nozzle (1) Heater Driving Begins (2) Heater Is Driven Ink Channel Connected to Ink Sponge (3) Heater Driving Stops (4) Bubbles Contract to form an Ink Drop (5) Ink Drop Is Ejected Ink Filter Joint Pipe Plastic Cover Common Ink Chamber Face Plate (part of plastic cover) Figure 4-16 Bubble Jet Nozzle (part) 4-21

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3.2.3 Construction of the bubble jet head unit
a) Bubble jet nozzle
Ink absorbed in the ink sponge will be filtered through the mesh ink filter, then fed
to the bubble jet nozzles via ink pipes.
When the head drive current passes through
a heater board in a nozzle, the ink will boil, producing bubbles.
These small bubbles
eventually coalesce into one large bubble.
The head drive current will be turned off
before the ink drop is discharged from the nozzle, but the after-heat of the heater
causes the bubble to grow larger and be discharged from the nozzle tip as an ink
drop.
The nozzle is replenished with ink after the ink has been ejected.
The print head uses semiconductor technology, in which the heaters and
I/C circuits are mounted on a silicon plate.
This silicon plate with
electrical circuitry is bonded to an aluminum base which is then attached
to a molded plastic cover with nozzles.
4-21
BJC-6000
Part 4: Technical Reference
Plastic Cover
Signal Circuit
Print Circuit Board
Ultra-thin Wire Connection
Wire Connection Protective Bond
Silicon Plate
Aluminum Plate
Heater Plate
Bubble Jet Nozzle
Common Ink Chamber
Face Plate (part of plastic cover)
Joint Pipe
Ink Filter
Ink Channel Connected to
Ink Sponge
(1) Heater Driving
Begins
(2) Heater Is Driven
(3) Heater Driving
Stops
(4) Bubbles Contract to
form an Ink Drop
(5) Ink Drop Is Ejected
Figure 4-16
Bubble Jet Nozzle (part)
NOTE