HP DL760 HP ProLiant DL760 Generation 2 Server User Guide - Page 78

Server Access Server I/O Lid and Modules The ProLiant DL760 G2 server chassis facilitates the installation of hardware upgrades through the use of three removable modules and a sliding I/O lid. The following table describes the contents of the modules and how to access the components. Table 3-1: Module and Bay Components and Access Module I/O module with system fans Contents PCI Hot Plug expansion slots Configuration switches Hot-plug fans 1 and 2 Processor and memory module Processor sockets Media module Memory (DIMMs) CD-ROM/ Diskette/IMD Hot-plug hard drives Access Method Slide the I/O lid toward the front of the server. Slide the I/O lid toward the front of the server. Slide the I/O lid toward the front of the server. Remove the processor and memory module and the processor board. Remove the memory cartridge. Access directly at the front of the server. Access directly at the front of the server. The following sections provide instructions for removing the processor and memory module, media module, and I/O module. For information pertaining to PCI Hot Plug and hot-plug fan access, refer to Chapter 5. CAUTION: Do not attempt to remove any of the three modules while power is applied to the system. They are not hot-pluggable. Immediate system shutdown and data loss will occur. 3-2 HP ProLiant DL760 Generation 2 Server User Guide