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Thermal Considerations

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Technical Reference 2.12 Thermal Considerations CAUTION The use of an Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board requires the following: • A chassis with appropriate airflow to ensure proper cooling of the components on the board • A processor fan heatsink that meets the thermal performance targets for Pentium 4 processors operating above 2.80 GHz Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the desktop board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance. CAUTION Ensure that the ambient temperature does not exceed the Desktop Board D845PEBT2's maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.14. CAUTION Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (item A in Figure 23) can reach a temperature of up to 85 °C in an open chassis. 83

Section	Page
Intel® Desktop Board D845PEBT2 Technical Product Specification	1
Revision History / Disclaimer	2
Preface	3
Intended Audience	3
What This Document Contains	3
Typographical Conventions	3
Notes, Cautions, and Warnings	3
Other Common Notation	4
Contents	5
1 Product Description	11
1.1 Overview	12
1.1.1 Feature Summary	12
1.1.2 Manufacturing Options	13
1.1.3 Board Layout	14
1.1.4 Block Diagram	15
1.2 Online Support	16
1.3 Operating System Support	16
1.4 Design Specifications	17
1.5 Processor	20
1.6 System Memory	21
1.7 Intel® 845PE Chipset	23
1.7.1 AGP	24
1.7.2 USB	24
1.7.3 IDE Support	25
1.7.4 Real-Time Clock, CMOS SRAM, and Battery	26
1.7.5 Intel® 82802AB Firmware Hub (FWH)	26
1.8 IDE RAID Controller (Optional)	27
1.9 Serial ATA Controller (Optional)	27
1.10 I/O Controller	28
1.10.1 Serial Ports	28
1.10.2 Parallel Port	28
1.10.3 Diskette Drive Controller	28
1.10.4 Keyboard and Mouse Interface	29
1.11 IEEE 1394a-2000 Controller (Optional)	29
1.12 Audio Subsystem	30
1.12.1 6-Channel Audio Subsystem (Optional)	30
1.12.2 2-Channel Audio Subsystem (Optional)	31
1.12.3 Audio Connectors	32
1.12.4 Audio Subsystem Software	32
1.13 LAN Subsystem	33
1.13.1 Intel® 82562ET Physical Layer Interface Device	33
1.13.2 RJ-45 LAN Connector with Integrated LEDs	33
1.13.3 LAN Subsystem Software	34
1.14 CNR (Optional)	34
1.15 Hardware Management Subsystem	35
1.15.2 Fan Monitoring	36
1.15.3 Chassis Intrusion and Detection	37
1.16 Power Management	37
1.16.1 ACPI	38
1.16.2 Hardware Support	40
2 Technical Reference	45
2.1 Introduction	45
2.2 Memory Map	45
2.3 Fixed I/O Map	46
2.4 DMA Channels	47
2.5 PCI Configuration Space Map	47
2.6 Interrupts	48
2.7 PCI Interrupt Routing Map	49
2.8 Connectors	51
2.8.1 Back Panel Connectors	52
2.8.2 Internal I/O Connectors	56
2.8.3 External I/O Connectors	68
2.9 Jumper Blocks	72
2.9.1 Front Panel Audio Connector/Jumper Block	72
2.9.2 BIOS Setup Configuration Jumper Block	73
2.10 Mechanical Considerations	74
2.10.1 D845PEBT2 Form Factor	74
2.10.2 I/O Shield	76
2.11 Electrical Considerations	79
2.11.1 Power Consumption	79
2.11.2 Add-in Board Considerations	79
2.11.3 Standby Current Requirements	80
2.11.4 Fan Connector Current Capability	81
2.11.5 Power Supply Considerations	82
2.12 Thermal Considerations	83
2.13 Reliability	85
2.14 Environmental	85
2.15 Regulatory Compliance	86
2.15.1 Safety Regulations	86
2.15.2 EMC Regulations	86
2.15.3 Product Certification Markings (Board Level)	87
3 Overview of BIOS Features	89
3.1 Introduction	89
3.2 BIOS Flash Memory Organization	90
3.3 PCI Autoconfiguration	90
3.4 System Management BIOS (SMBIOS)	90
3.5 Legacy USB Support	91
3.6 BIOS Updates	91
3.6.1 Language Support	92
3.6.2 Custom Splash Screen	92
3.7 Recovering BIOS Data	92
3.8 Boot Options	93
3.8.1 CD-ROM Boot	93
3.8.2 Network Boot	93
3.8.3 Booting Without Attached Devices	93
3.9 Changing the Default Boot Device During POST	94
3.10 Fast Booting Systems with Intel® Rapid BIOS Boot	94
3.10.1 Peripheral Selection and Configuration	94
3.10.2 Intel Rapid BIOS Boot	95
3.11 BIOS Security Features	96
4 BIOS Setup Program	97
4.1 Introduction	97
4.2 Maintenance Menu	98
4.3 Main Menu	99
4.4 Advanced Menu	100
4.4.1 PCI Configuration Submenu	101
4.4.2 Boot Configuration Submenu	102
4.4.3 Peripheral Configuration Submenu	103
4.4.4 IDE Configuration Submenu	105
4.4.5 Diskette Configuration Submenu	107
4.4.6 Event Log Configuration Submenu	108
4.4.7 Video Configuration Submenu	109
4.4.8 USB Configuration Submenu	110
4.4.9 Chipset Configuration Submenu	111
4.4.10 Fan Control Configuration Submenu	112
4.5 Security Menu	113
4.6 Power Menu	114
4.6.1 ACPI Submenu	114
4.7 Boot Menu	115
4.7.1 Boot Device Priority Submenu	116
4.7.2 Hard Disk Drives Submenu	117
4.7.3 Removable Devices Submenu	117
4.7.4 ATAPI CD-ROM Drives Submenu	118
4.8 Exit Menu	118
5 Error Messages and Beep Codes	119
5.1 BIOS Error Messages	119
5.2 Port 80h POST Codes	121
5.3 Bus Initialization Checkpoints	125
5.4 Speaker	126

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Technical Reference

2.12 Thermal Considerations

CAUTION

The use of an Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board

requires the following:

•

A chassis with appropriate airflow to ensure proper cooling of the components on the board

•

A processor fan heatsink that meets the thermal performance targets for Pentium 4 processors

operating above 2.80 GHz

Failure to ensure appropriate airflow may result in reduced performance of both the processor

and/or voltage regulator or, in some instances, damage to the desktop board.

For a list of chassis

that have been tested with Intel desktop boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely

with the reader.

Intel makes no warranties or representations that merely following the

instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the Desktop Board D845PEBT2

’

s maximum

operating temperature.

Failure to do so could cause components to exceed their maximum case

temperature and malfunction.

For information about the maximum operating temperature, see the

environmental specifications in Section 2.14.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit.

Failure to do

so may result in damage to the voltage regulator circuit.

The processor voltage regulator area

(item A in Figure 23) can reach a temperature of up to 85

C in an open chassis.