HP Stitch S1000 User Guide - Page 228

There are ink marks on the substrate, The substrate sticks to the platen, case

Page 228 highlights

5. If you have experienced a substrate crash because the lateral edge of the substrate in the print zone is not flat enough, and is raised or even partially cut because you are not using edge holders, then you are recommended to use them. NOTE: If you are already using edge holders, check that they are correctly positioned (see The substrate edge holders on page 40). 6. Start with the recommended configuration for each substrate, and increase vacuum and tension step by step, in steps of 5 mmH2O for vacuum and 5 N·m for tension. TIP: If you have suffered a substrate crash, try starting with step iv and moving backwards up the table until you find settings that work. 7. Try increasing the drying airflow to help the substrate to dry faster. 8. Try raising the carriage beam slightly, so that the printhead is not so close to the substrate. For information on how to adjust printer settings, see Edit a substrate preset on page 51. There are ink marks on the substrate This problem can occur if any component in contact with the substrate is dirty. Check the pinchwheels, bottom plate, print platen, output cover, and roller, and clean them if necessary. If the ink marks occur at the sides of the substrate and not in the center, and you are using the substrate edge holders, check that they are correctly placed and clean. The substrate sticks to the platen When the substrate sticks to the platen, the most likely causes are excessive heat applied by the drying system, excessive vacuum, or a dirty platen, which increases friction and can impede the substrate advance. In the latter case, the substrate may rise up in a bubble or wave before reaching the platen. Here are some suggested ways to correct the problem: 1. Check that the substrate you are using is the same type as the one you have selected in the Internal Print Server. 2. Check that you are printing on the correct side of the substrate. 3. Check that you are using the generic substrate preset for the substrate category. The use of incorrect values could cause incorrect substrate behavior. 4. Reload the substrate and try to minimize skew while loading. Check that you are loading the substrate using the correct procedure. 5. Start with the recommended configuration for each substrate, and increase vacuum and tension step by step, in steps of 5 mmH2O for vacuum and 5 N·m for tension. 222 Chapter 12 Troubleshoot substrate issues ENWW

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5.
If you have experienced a substrate crash because the lateral edge of the substrate in the print zone is not
flat enough, and is raised or even partially cut because you are not using edge holders, then you are
recommended to use them.
NOTE:
If you are already using edge holders, check that they are correctly positioned (see
The substrate
edge holders
on page
40
).
6.
Start with the recommended configuration for each substrate, and increase vacuum and tension step by
step, in steps of 5 mmH
2
O for vacuum and 5 N·m for tension.
TIP:
If you have suffered a substrate crash, try starting with step iv and moving backwards up the table
until you find settings that work.
7.
Try increasing the drying airflow to help the substrate to dry faster.
8.
Try raising the carriage beam slightly, so that the printhead is not so close to the substrate.
For information on how to adjust printer settings, see
Edit a substrate preset
on page
51
.
There are ink marks on the substrate
This problem can occur if any component in contact with the substrate is dirty. Check the pinchwheels, bottom
plate, print platen, output cover, and roller, and clean them if necessary.
If the ink marks occur at the sides of the substrate and not in the center, and you are using the substrate edge
holders, check that they are correctly placed and clean.
The substrate sticks to the platen
When the substrate sticks to the platen, the most likely causes are excessive heat applied by the drying system,
excessive vacuum, or a dirty platen, which increases friction and can impede the substrate advance. In the latter
case, the substrate may rise up in a bubble or wave before reaching the platen.
Here are some suggested ways to correct the problem:
1.
Check that the substrate you are using is the same type as the one you have selected in the Internal Print
Server.
2.
Check that you are printing on the correct side of the substrate.
3.
Check that you are using the generic substrate preset for the substrate category. The use of incorrect
values could cause incorrect substrate behavior.
4.
Reload the substrate and try to minimize skew while loading. Check that you are loading the substrate
using the correct procedure.
5.
Start with the recommended configuration for each substrate, and increase vacuum and tension step by
step, in steps of 5 mmH
2
O for vacuum and 5 N·m for tension.
222
Chapter 12
Troubleshoot substrate issues
ENWW