Intel X5365 Design Guide

Intel X5365 - Xeon 3.0 GHz 8M L2 Cache 1333MHz FSB LGA771 Quad-Core Processor Manual

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  • Intel X5365 | Design Guide - Page 1
    Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines April 2007 Document Number: 315794, Revision: 002
  • Intel X5365 | Design Guide - Page 2
    or incompatibilities arising from future changes to them. The Quad-Core Intel® Xeon® Processor 5300 Series may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available upon request. Contact your
  • Intel X5365 | Design Guide - Page 3
    Reference Design 13 2.1 Mechanical Requirements 13 2.1.1 Processor Mechanical Parameters 13 2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package 14 2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations 18 2.2 Processor Thermal Parameters and Features 18 2.2.1 Thermal Control
  • Intel X5365 | Design Guide - Page 4
    3 15 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3 16 Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3 17 Processor Case Temperature Measurement Location 19 DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series 21 Processor Core Geometric
  • Intel X5365 | Design Guide - Page 5
    B-2 B-3 B-4 B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 58 2U CEK Heatsink (Sheet 1 of 4 60 2U CEK Heatsink (Sheet 2 of 4 61
  • Intel X5365 | Design Guide - Page 6
    Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series 33 2-7 Fan Speed Control, TCONTROL and DTS Relationship 34 2-8 CEK Heatsink Thermal Mechanical Characteristics 49 2-9 Recommended Thermal Grease Dispense Weight 49 2-10 Fan Specifications (Boxed 4-wire PWM/DTS
  • Intel X5365 | Design Guide - Page 7
    Revision History Reference Number 315794 315794 Revision Number 001 002 Description • Initial release of the document. • Added Quad-Core Intel® Xeon® Processor L5300 Series • Added Appendix A,1U Alternative Heatsink Thermal/Mechanical Design chapter • Add mechanical drawings Figures B-21 - B-24 §
  • Intel X5365 | Design Guide - Page 8
    8 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 9
    Recycling Standards Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide Intel® Xeon® Processor Thermal Design Guidelines LGA771 Socket Mechanical Design Guide LGA771 SMT Socket Design Guidelines LGA771 Daisy Chain Test Vehicle User Guide Quad-Core Intel® Xeon® Processor-Based Servers
  • Intel X5365 | Design Guide - Page 10
    format) Quad-Core Intel® Xeon® Processor 5300 Series_Enabled_CEK_Thermal_Models (in Flotherm* and Icepak*) Quad-Core Intel® Xeon® Processor 5300 Series_Package_Thermal_Models (in Flotherm* and Icepak*) Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG) Thin Electronics Bay Specification
  • Intel X5365 | Design Guide - Page 11
    the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 11
  • Intel X5365 | Design Guide - Page 12
    Introduction 12 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 13
    targets listed in Table 2-1 above. 3. These socket limits are defined in the LGA771 Socket Mechanical Design Guide. 4. These package handling limits are defined in the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 5. Shear load that can be applied to the package IHS. 6. Tensile load that
  • Intel X5365 | Design Guide - Page 14
    Package The Quad-Core Intel® Xeon® Processor 5300 Series is packaged using the flip-chip land grid array (FC-LGA6) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for detailed mechanical specifications. The Quad-Core Intel® Xeon® Processor 5300 Series
  • Intel X5365 | Design Guide - Page 15
    Thermal/Mechanical Reference Design Figure 2-1. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 15
  • Intel X5365 | Design Guide - Page 16
    Thermal/Mechanical Reference Design Figure 2-2. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3) 16 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 17
    Thermal/Mechanical Reference Design Figure 2-3. Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 17
  • Intel X5365 | Design Guide - Page 18
    the system must support. The overall specification is required to achieve optimal operation and long-term reliability (See the Intel® Xeon® Dual and Multi Processor Family Thermal Test Vehicle User's Guide for Case Temperature definition and measurement methods). 18 Quad-Core Intel® Xeon® Processor
  • Intel X5365 | Design Guide - Page 19
    (DTS) on the Quad-Core Intel® Xeon® Processor 5300 Series, the DTS reports a relative temperature delta below the PROCHOT# assertion temperature (see Section 2.2.2 for more details on the Digital Thermal Sensor). Thermal solutions must be designed to the processor specifications (i.e Thermal Profile
  • Intel X5365 | Design Guide - Page 20
    to PECI Feature Set Overview. For more detail information on PECI, please refer to Platform Environment Control Interface (PECI) Specification and Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 20 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 21
    by the thermal profile. See Section 2.2.6 for information on TCONTROL. The PECI signal is available through CPU pin (G5) on each LAG771 socket for the Quad-Core Intel® Xeon® Processor 5300 Series. Through this pin, the dual domains receive all temperature sensor values and provide the current
  • Intel X5365 | Design Guide - Page 22
    and core4 in Quad-Core Intel® Xeon® Processor 5300 Series. 2. For more information on PROCHOT#, THERMTRIP#, and FORCEPR# see the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet. 2.2.4.4 Heatpipe Orientation for Multiple Core Processors Thermal management of multiple core processors can be
  • Intel X5365 | Design Guide - Page 23
    Core1 X1, X2, X3, X4 Y X Table 2-3. Processor Core Geometric Center Dimensions Feature Core 1 Core 2 Core 3 Core 4 X Dimension 19.53 mm 19.53 mm 19.53 mm 19.53 mm Y Dimension 6.41 mm 10.56 mm 18.94 mm 23.09 mm Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines
  • Intel X5365 | Design Guide - Page 24
    the Thermal Profile specification, a thermal solution must be at or below the Thermal Profile line for the given processor when its processor local ambient temperature that can meet a given Thermal Profile. If the case-to-ambient resistance and the local ambient 24 Quad-Core Intel® Xeon® Processor
  • Intel X5365 | Design Guide - Page 25
    processor individually. For the Quad-Core Intel® Xeon® Processor 5300 Series, the TCONTROL value is obtained by reading a processor model specific the Conroe and Woodcrest Processor Family BIOS Writer's Guide (BWG) for further details. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical
  • Intel X5365 | Design Guide - Page 26
    height), it is very challenging to meet the thermal requirements of the processor. To mitigate these form factor constraints, Intel has developed a dual Thermal Profile specification, shown in Figure 2-10. 26 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 27
    impose any additional risk to Intel's long-term reliability requirements. Thermal solutions that exceed Thermal Profile B specification are considered incompliant and will adversely affect the long-term reliability of the processor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical
  • Intel X5365 | Design Guide - Page 28
    expected to impact the performance of the processor. A worst case real world application is defined as a commercially processor. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet or Section 2.2.8 for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Profile specifications
  • Intel X5365 | Design Guide - Page 29
    are for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the Datasheet supersedes any data in this figure. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design
  • Intel X5365 | Design Guide - Page 30
    for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the Datasheet supersedes any data in this figure. 30 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design
  • Intel X5365 | Design Guide - Page 31
    Note: 40 0 10 20 30 40 50 Pow er [W] The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the Datasheet supersedes any
  • Intel X5365 | Design Guide - Page 32
    the heatsink fins Mean + 3σ Note: In case of conflict, the processor Datasheet supersedes the information contained in the TMDG. Table 2-5. Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series Parameter Maximum Unit Notes Altitude TLA TDP Sea-Level
  • Intel X5365 | Design Guide - Page 33
    in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system level acoustic noise down. Figure 2-14 depicts the relationship between TCONTROL and FSC methodology. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 33
  • Intel X5365 | Design Guide - Page 34
    of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TCONTOL value for a given processor. 34 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 35
    measure of the thermal performance of the overall thermal solution that is attached to the processor package. It is defined by the following equation, and measured in units of thermal characterization parameters. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 36
    numbers used here are not related to any Intel processor thermal specifications, and are for illustrative purposes only. Assume the processor ambient temperature has a significant positive effect on the case-to-ambient thermal resistance requirement. 36 Quad-Core Intel® Xeon® Processor
  • Intel X5365 | Design Guide - Page 37
    processor. The size and type (passive or active) of the thermal solution and the amount of system airflow can be traded off against each other to meet specific , and conductivity of the conduction path from Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 37
  • Intel X5365 | Design Guide - Page 38
    the measured TCASE value of a given processor can decrease over time depending on the type of TIM material. Refer to Section 2.4.7.2 for information on the TIM used in the Intel reference heatsink solution. 38 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG
  • Intel X5365 | Design Guide - Page 39
    at the heatsink, airflow (CFM), the power being dissipated by the processor, and the corresponding maximum TCASE. These parameters are usually combined in a provided in the LGA771 Socket Mechanical Design Guide. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 40
    Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5300 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists
  • Intel X5365 | Design Guide - Page 41
    make changes and modifications to the design as necessary. The thermal mechanical reference design for the Quad-Core Intel® Xeon® Processor 5300 Series was verified according to the Intel validation criteria given in Appendix E. Any thermal mechanical design using some of the reference components in
  • Intel X5365 | Design Guide - Page 42
    use with the Quad-Core Intel® Xeon® Processor 5300 Series, they must support the following Quad-Core Intel® Xeon® Processor 5300 Series Datasheet and LGA771 Socket Mechanical Design Guide and for specific details on package/socket loading specifications. 42 Quad-Core Intel® Xeon® Processor
  • Intel X5365 | Design Guide - Page 43
    as: Equation 2-8.y = 0.190x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-19 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A specification. The 2U+ CEK solution
  • Intel X5365 | Design Guide - Page 44
    Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile A 65 TCASE_MAX_A@TDP Temperature 's Thermal Profile to the Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B specification. The 1U CEK solution
  • Intel X5365 | Design Guide - Page 45
    power value (W) Figure 2-21 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 3.7°C margin at the lower end (P_PROFILE_MIN) and
  • Intel X5365 | Design Guide - Page 46
    power value (W) Figure 2-22 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 4.5 °C margin at the lower end (P_PROFILE_MIN) and
  • Intel X5365 | Design Guide - Page 47
    an 1U alternative reference heatsink design. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series and offers the advantages of weight reduction and cost savings in using this
  • Intel X5365 | Design Guide - Page 48
    load, especially in lateral conditions, when compared to the amount of load transmitted to the processor package. As such, it is comprised of steel. The distance from the bottom of the to grow its base and 48 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 49
    . The retention scheme employed by CEK is designed to support heavy heatsinks (approximately up to 1000 grams) in cases thermal grease. For guidance with your specific application, please contact the vendor. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 49
  • Intel X5365 | Design Guide - Page 50
    detailed mechanical drawings of the CEK spring. Also, the baseboard keepout requirements shown in Appendix B must be met to use this CEK spring design. 50 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 51
    Reference Design 2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5300 Series. This active heatsink solution is primarily designed
  • Intel X5365 | Design Guide - Page 52
    fan power header to support the boxed processor. Table 2-10 contains specifications for the input and , at a nominal 25 KHz frequency. If a 3-pin CPU fan header is used instead, the active fan heatsink solution Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 53
    control. This control method requires the motherboard provide the correct PWM duty cycle to specification in order to avoid damage. The boxed processor contains the components necessary to solve both issues. The boxed processor will include the following items: • Quad-Core Intel® Xeon® Processor
  • Intel X5365 | Design Guide - Page 54
    be shipped with either the chassis or boards. They are as follows: • CEK Spring (supplied by baseboard vendors) • Heatsink standoffs (supplied by chassis vendors) § 54 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 55
    for the rack optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series and offers the advantages of weight reduction and cost savings in using this
  • Intel X5365 | Design Guide - Page 56
    (mm) [in.] (kg) [lbs] (m3/hr) [CFM] 1U 27.00 0.24 [0.53] 25.5 [15] [1.06] (°C/W) 0.304 (°C/W) 0.007 Pressure Drop (Pa) [in H2O] 82.4 [0.331] 56 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 57
    power value (W) Figure A-3 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 1.8°C margin at the lower end (P_PROFILE_MIN) and
  • Intel X5365 | Design Guide - Page 58
    power value (W) Figure A-4 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 2.8°C margin at the lower end (P_PROFILE_MIN) and
  • Intel X5365 | Design Guide - Page 59
    B-7 Figure B-8 Figure B-9 Figure B-10 Figure B-11 Figure B-12 Figure B-13 Figure B-14 Figure B-15 Figure B-16 Figure B-17 Figure B-18 Figure B-19 Figure B-20 Figure B-21 Figure B-22 Figure B-23 Figure B-24 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 59
  • Intel X5365 | Design Guide - Page 60
    Figure B-1. 2U CEK Heatsink (Sheet 1 of 4) Mechanical Drawings 60 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 61
    Mechanical Drawings Figure B-2. 2U CEK Heatsink (Sheet 2 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 61
  • Intel X5365 | Design Guide - Page 62
    Figure B-3. 2U CEK Heatsink (Sheet 3 of 4) Mechanical Drawings 62 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 63
    Mechanical Drawings Figure B-4. 2U CEK Heatsink (Sheet 4 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 63
  • Intel X5365 | Design Guide - Page 64
    Figure B-5. CEK Spring (Sheet 1 of 3) Mechanical Drawings 64 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 65
    Mechanical Drawings Figure B-6. CEK Spring (Sheet 2 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 65
  • Intel X5365 | Design Guide - Page 66
    Figure B-7. CEK Spring (Sheet 3 of 3) Mechanical Drawings 66 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 67
    Mechanical Drawings Figure B-8. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 67
  • Intel X5365 | Design Guide - Page 68
    Mechanical Drawings Figure B-9. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6) 68 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 69
    Mechanical Drawings Figure B-10. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 69
  • Intel X5365 | Design Guide - Page 70
    Mechanical Drawings Figure B-11. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6) 70 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 71
    Mechanical Drawings Figure B-12. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 71
  • Intel X5365 | Design Guide - Page 72
    Mechanical Drawings Figure B-13. Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6) 72 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 73
    Mechanical Drawings Figure B-14. 1U CEK Heatsink (Sheet 1 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 73
  • Intel X5365 | Design Guide - Page 74
    Figure B-15. 1U CEK Heatsink (Sheet 2 of 4) Mechanical Drawings 74 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 75
    Mechanical Drawings Figure B-16. 1U CEK Heatsink (Sheet 3 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 75
  • Intel X5365 | Design Guide - Page 76
    Figure B-17. 1U CEK Heatsink (Sheet 4of 4) Mechanical Drawings 76 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 77
    Mechanical Drawings Figure B-18. Active CEK Thermal Solution Volumetric (Sheet 1 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 77
  • Intel X5365 | Design Guide - Page 78
    Mechanical Drawings Figure B-19. Active CEK Thermal Solution Volumetric (Sheet 2 of 3) 78 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 79
    Mechanical Drawings Figure B-20. Active CEK Thermal Solution Volumetric (Sheet 3 of 3) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 79
  • Intel X5365 | Design Guide - Page 80
    Figure B-21. 1U Alternative Heatsink (1 of 4) Mechanical Drawings 80 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 81
    Mechanical Drawings Figure B-22. 1U Alternative Heatsink (2 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 81
  • Intel X5365 | Design Guide - Page 82
    Figure B-23. 1U Alternative Heatsink (3 of 4) Mechanical Drawings 82 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 83
    Mechanical Drawings Figure B-24. 1U Alternative Heatsink (4 of 4) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 83
  • Intel X5365 | Design Guide - Page 84
    Mechanical Drawings § 84 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 85
    heatsink base is artificially raised. The measurement load offset depends on the whole assembly stiffness (i.e. motherboard, clip, fastener, etc.). For example, the Quad-Core Intel® Xeon® Processor 5300 Series CEK Reference Heatsink Design clip and fasteners assembly have a stiffness of around 160
  • Intel X5365 | Design Guide - Page 86
    C-1. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View Heatsink Base Pocket Diameter ~ 29 mm [~1.15"] Package IHS Outline (Top Surface) Load Cells 86 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 87
    height of selected load cell Wax to maintain load cell in position during heatsink installation Figure C-3. Preload Test Configuration Preload Fixture (copper core with milled out pocket) Load Cells (3x) Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 87
  • Intel X5365 | Design Guide - Page 88
    3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5300 Series CEK-reference heatsink example in Figure C-3, and actuate attach mechanism. 88 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 89
    5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 89
  • Intel X5365 | Design Guide - Page 90
    Heatsink Clip Load Methodology 90 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 91
    -2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 91
  • Intel X5365 | Design Guide - Page 92
    Safety Requirements 92 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 93
    be found in the LGA771 Socket Mechanical Design Guide. The use condition environment definitions provided in Appendix E-1 are based on speculative use condition assumptions, and are provided as examples only. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG
  • Intel X5365 | Design Guide - Page 94
    seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 94 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 95
    Thermal compliance testing to demonstrate that the case temperature specification can be met. Recommended BIOS/Processor/Memory Test Procedures This test is to ensure not fully defined and may change. § Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 95
  • Intel X5365 | Design Guide - Page 96
    Quality and Reliability Requirements 96 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
  • Intel X5365 | Design Guide - Page 97
    Table F-1. For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5300 Series thermal mechanical enabling components drawings in Appendix B. Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series Intel Reference Solution (Sheet 1 of 2) Assembly CEK771-01-2U
  • Intel X5365 | Design Guide - Page 98
    reference heatsink design for Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors. F.1.2 Additional Suppliers The Intel enabled solutions for Quad-Core Intel® Xeon® Processor 5300 Series are preliminary
  • Intel X5365 | Design Guide - Page 99
    Information Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series Intel Reference Solution (Sheet 1 of 2) [email protected] 603-223-1724 Copper Fin Copper Base - and - ADDA Corporation CNDA#AP1249 Frank Hsue [email protected] 886-2-26989888 x306 Jungpin Chen
  • Intel X5365 | Design Guide - Page 100
    Enabled Suppliers Information Table F-2. Assembly 1U Heatsink Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5300 Series Intel Reference Solution (Sheet 2 of 2) Component Alternative CEK Heatsink Description Copper Fin, Copper Base Development Suppliers Aavid Thermalloy CNDA#
  • 1
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Document Number: 315794, Revision: 002
Quad-Core Intel® Xeon® Processor
5300 Series
Thermal/Mechanical Design Guidelines
April 2007