Intel X5365 Design Guide - Page 9

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

9

Introduction

1

Introduction

1.1

Objective

The purpose of this guide is to describe the reference thermal solution and design

parameters required for Quad-Core Intel® Xeon® Processor 5300 Series. The

Quad-Core Intel® Xeon® Processor X5300 Series refers to the 120W TDP skus of the

product. These processors are performance-optimized and provide optimal overall

performance. The Quad-Core Intel® Xeon® Processor E5300 Series refers to the 80W

TDP skus of the product. These processors are rack-optimized and provide optimal

performance per watt. The Quad-Core Intel® Xeon® Processor L5300 Series refers to

the 50W TDP skus of the product. These processors are rack-optimized and provide

optimal power efficiency. Unless other stated, all reference to “Quad-Core Intel®

Xeon® Processor 5300 Series” in this document pertain to the Quad-Core Intel®

Xeon® Processor X5300 Series, Quad-Core Intel® Xeon® Processor E5300 Series and

Quad-Core Intel® Xeon® Processor L5300 Series. It is also the intent of this document

to comprehend and demonstrate the processor cooling solution features and

requirements. Furthermore, this document provides an understanding of the processor

thermal characteristics, and discusses guidelines for meeting the thermal requirements

imposed on the entire life of the processor. The thermal/mechanical solutions described

in this document are intended to aid component and system designers in the

development and evaluation of processor compatible thermal/mechanical solutions.

1.2

Scope

The thermal/mechanical solutions described in this document pertain to a solution(s)

intended for use with the Quad-Core Intel® Xeon® Processor 5300 Series in 1U, 2U,

2U+ and workstation form factors systems. This document contains the mechanical

and thermal requirements of the processor cooling solution. In case of conflict, the data

in the

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

supersedes any data

in this document. Additional information is provided as a reference in the appendices.

1.3

References

Material and concepts available in the following documents may be beneficial when

reading this document.

Table 1-1.

Reference Documents (Sheet 1 of 2)

Document

Comment

European Blue Angel Recycling Standards

http://www.blauer-engel.de

Intel

®

Xeon

®

Processor Family Thermal Test Vehicle User's Guide

See Note at bottom table.

Intel

®

Xeon

®

Processor Thermal Design Guidelines

http://developer.intel.com/

LGA771 Socket Mechanical Design Guide

See Note following table.

LGA771

SMT

Socket Design Guidelines


LGA771 Daisy Chain Test Vehicle User Guide


Quad-Core Intel® Xeon® Processor-Based Servers Platform Design

Guide (PDG)


Stoakley Platform Design Guide (PDG)


PECI Feature Set Overview

See Note following table

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 9

Introduction, 1.1 Objective, 1.2 Scope, 1.3 References, Objective, Scope - xeon processors

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