Intel X5365 Design Guide - Page 4

4

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

D

Safety Requirements

................................................................................................

91

E

Quality and Reliability Requirements

.......................................................................

93

E.1

Intel Verification Criteria for the Reference Designs

................................................

93

E.1.1

Reference Heatsink Thermal Verification

....................................................

93

E.1.2

Environmental Reliability Testing

..............................................................

93

E.1.3

Material and Recycling Requirements

.........................................................

95

F

Enabled Suppliers Information

.................................................................................

97

F.1

Supplier Information

..........................................................................................

97

F.1.1

Intel Enabled Suppliers

............................................................................

97

F.1.2

Additional Suppliers

................................................................................

98

Figures

2-1

Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3)

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15

2-2


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16

2-3


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17

2-4

Processor Case Temperature Measurement Location

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19

2-5

DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series

............................

21

2-6

Processor Core Geometric Center Locations

...........................................................

23

2-7

Thermal Profile Diagram

.....................................................................................

24

2-8

TCONTROL Value and Digital Thermal Sensor Value Interaction

................................

25

2-9

TCONTROL and Thermal Profile Interaction

............................................................

26

2-10

Dual Thermal Profile Diagram

..............................................................................

27

2-11

Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300

Series

..............................................................................................................

29

2-12

Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series

.......................

30

2-13

Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series

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31

2-14

TCONTROL and Fan Speed Control

.......................................................................

34

2-15

Processor Thermal Characterization Parameter Relationships

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36

2-16

Exploded View of CEK Thermal Solution Components

..............................................

40

2-17

2U+ CEK Heatsink Thermal Performance

...............................................................

42

2-18

1U CEK Heatsink Thermal Performance

.................................................................

43

2-19

2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300

Series Thermal Profile A

......................................................................................

44

2-20

1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300

Series Thermal Profile B

......................................................................................

45

2-21

1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300

Series Thermal Profile

........................................................................................

46

2-22

1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300

Series Thermal Profile

........................................................................................

47

2-23

Isometric View of the 2U+ CEK Heatsink

...............................................................

48

2-24

Isometric View of the 1U CEK Heatsink

.................................................................

48

2-25

CEK Spring Isometric View

..................................................................................

50

2-26

Isometric View of CEK Spring Attachment to the Base Board

...................................

50

2-27

Boxed Active CEK Heatsink Solutions with PWM/DTS Control

(Representation Only)

........................................................................................

51

2-28

Fan Cable Connection (Active CEK)

......................................................................

52

A-1

Isometric View of the 1U Alternative Heatsink

........................................................

55

A-2

1U Alternative Heatsink Thermal Performance

.......................................................

56

A-3

1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

Processor E5300 Series Thermal Profile

................................................................

57

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 4

s, Thermal Profiles A and B for the Quad-Core Intel® Xeon® Processor X5300

Page 4 highlights