Intel X5365 Design Guide - Page 45

Equation 2-10.y = 0.249x + 40

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Thermal/Mechanical Reference Design Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile B 70 TCASE_MAX_B @ TDP Temperature ( C) 65 60 55 50 TCASE_MAX_B @ P_PROFILE_MIN_B 45 Thermal Profile B Y = 0.224 * X + 43.1 1U CEK Reference Solution Y = 0.249 * X + 40 40 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 90 100 110 120 P _PROFILE_MIN_B Power (W) TDP The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5300 Series in volumetrically constrained form factors. From Table 2-5 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.249 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation 2-10.y = 0.249x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure 2-21 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 3.7°C margin at the lower end (P_PROFILE_MIN) and 6.1°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 45

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Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)
45
Thermal/Mechanical Reference Design
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile for
the Quad-Core Intel® Xeon® Processor E5300 Series in volumetrically constrained
form factors. From
Table 2-5
the three-sigma (mean+3sigma) performance of the
thermal solution is computed to be 0.249 °C/W and the processor local ambient
temperature (T
LA
) for this thermal solution is 40 °C. Hence, the Thermal Profile
equation for this thermal solution is calculated as:
Equation 2-10.y = 0.249x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-21
below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile with 3.7°C margin at the
lower end (P
_PROFILE_MIN
) and 6.1°C margin at the upper end (TDP). By designing to
Thermal Profile, it is ensured that no measurable performance loss due to TCC
activation is observed under the given environmental conditions.
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300
Series Thermal Profile B
40
45
50
55
60
65
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Power (W)
Temperature (
C
)
T
CASE_MAX_B
@ P
Thermal Profile B
Y = 0.224 * X + 43.1
1U CEK Reference Solution
Y = 0.249 * X + 40
T
CASE_MAX_B
@ TDP
90
100
110
_PROFILE_MIN_B
P
_PROFILE_MIN_B
TDP
120
70