Intel X5365 Design Guide - Page 51

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

51

Thermal/Mechanical Reference Design

2.4.8

Boxed Active Thermal Solution for the

Quad-Core Intel® Xeon® Processor 5300 Series

Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed

Quad-Core Intel® Xeon® Processor 5300 Series. This active heatsink solution is

primarily designed to be used in a pedestal chassis where sufficient air inlet space is

present and side directional airflow is not an issue. This active heatsink solution

consists of a 4 wire PWM fan and a 1U passive heatsink compatible with 1U form factors

both mechanically and thermally. These solutions are intended for system integrators

who build systems from components available through distribution channels. The

retention solution used for these products is called the CEK. The CEK base is

compatible with all the heatsink solutions.

Figure 2-27

provides a representation of the active CEK solution. This design is based

on a 4-pin PWM PECI/DTS controlled active fan heatsink solution. PWM (Pulse Width

Modulation also synonymous with Pulse Duration Modulation PDM) is a modulation in

which the duration of pulse is varied in accordance with some characteristic of the

modulating signal. This solution is being offered to help provide better control over

pedestal chassis acoustics. This is achieved though accurate measurement of processor

temperature through the processor’s

Digital Thermal Sensor (DTS) temperature. Fan

RPM is modulated through the use an ASIC (Application Specific Integrated Circuit)

located on the serverboard, that sends out a PWM control signal to the 4

th

pin of the

connector labeled as Control.

This heatsink solution also requires a constant +12 V supplied to pin 2 and does not

support variable voltage control or 3-pin PWM control. If no PWM signal is detected on

the 4

th

pin this heatsink solution will revert back to thermistor control mode,

supporting both the 4-wire PWM and standard 3-wire ambient air control methods.

The active heatsink solution will not exceed a mass of approximately 1050 grams. Note

that this is per processor, so a dual processor system will have up to approximately

2100 grams total mass in the heatsinks. This large mass will require a minimum

chassis stiffness to be met in order to withstand force during shock and vibration.

Figure 2-27. Boxed Active CEK Heatsink Solutions with PWM/DTS Control

(Representation Only)

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 51

Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series

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