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A 1U Alternative Heatsink Thermal/Mechanical Design, A.1 Component Overview, A-1.

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1U Alternative Heatsink Thermal/Mechanical Design A 1U Alternative Heatsink Thermal/Mechanical Design Intel has also developed an 1U alternative reference heatsink design for the volumetrically constrained form factor and targeted for the rack optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink. This section describes the alternative heatsink thermal performance and adherence to Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon® Processor L5300 Series thermal profile specifications. A.1 Component Overview The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive standoff/screws, Thermal Interface Material (TIM) and Spring. Figure A-1 shows the isometric view of the 1U alternative heatsink. Figure A-1. Isometric View of the 1U Alternative Heatsink Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 55

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

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Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

1U Alternative Heatsink Thermal/Mechanical Design

1U Alternative Heatsink

Thermal/Mechanical Design

Intel has also developed an 1U alternative reference heatsink design for the

volumetrically constrained form factor and targeted for the rack optimized and ultra

dense SKUs. This alternative heatsink design meets the thermal profile specifications of

the Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon®

Processor L5300 Series and offers the advantages of weight reduction and cost savings

in using this alternative 1U heatsink.

This section describes the alternative heatsink thermal performance and adherence to

Quad-Core Intel® Xeon® Processor E5300 Series and Quad-Core Intel® Xeon®

Processor L5300 Series thermal profile specifications.

A.1

Component Overview

The alternative 1U reference heatsink is an extruded aluminum heatsink and shares the

same volumetric footprint as the 1U CEK heatsink. It reuses Intel 1U CEK Captive

standoff/screws, Thermal Interface Material (TIM) and Spring.

Figure A-1

shows the isometric view of the 1U alternative heatsink.

Note:

Refer to

Appendix B

for more detailed mechanical drawings of the heatsink.

Figure A-1.

Isometric View of the 1U Alternative Heatsink