Intel X5365 Design Guide - Page 28

Thermal/Mechanical Reference Design

28

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Refer to the

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

or

Section 2.2.8

for the Thermal Profile A and Thermal Profile B specifications.

Section 2.4

of this document also provides details on the 2U+ and 1U Intel reference thermal

solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5300

Series Thermal Profile A and Thermal Profile B respectively.

2.2.7.2

Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor

E5300/L5300 Series

The Quad-Core Intel® Xeon® Processor E5300/L5300 Series is designed to go into

various form factors, including the volumetrically constrained 1U and custom blade

form factors.

Designing to the Thermal Profile ensures that no measurable performance loss due to

Thermal Control Circuit (TCC) activation is observed in the processor. It is expected

that TCC would only be activated for very brief periods of time when running a worst-

case real world application in a worst-case thermal condition. These brief instances of

TCC activation are not expected to impact the performance of the processor. A worst

case real world application is defined as a commercially available, useful application

which dissipates a power equal to, or above, the TDP for a thermally relevant

timeframe. One example of a worst-case thermal condition is when a processor local

ambient temperature is at or above 42.6°C for Quad-Core Intel® Xeon® Processor

E5300 Series Thermal Profile.

Thermal solutions that exceed the Thermal Profile specification are considered

incompliant and will adversely affect the long-term reliability of the processor.

Refer to the

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

or

Section 2.2.8

for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Profile

specifications.

Section 2.4

and

Section A

of this document provide details on 1U Intel

reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon®

Processor E5300/L5300 Series Thermal Profile.

2.2.8

Performance Targets

The Thermal Profile specifications for this processor are published in the

Quad-Core

Intel® Xeon® Processor 5300 Series Datasheet.

These Thermal Profile specifications

are shown as a reference in the subsequent discussions.

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 28

Performance Targets

Page 28 highlights