Intel X5365 Design Guide - Page 93
E Quality and Reliability Requirements, E.1 Intel Verification Criteria for the Reference Designs
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Quality and Reliability Requirements E Quality and Reliability Requirements E.1 E.1.1 E.1.2 E.1.2.1 Intel Verification Criteria for the Reference Designs Reference Heatsink Thermal Verification The Intel reference heatsinks will be verified within specific boundary conditions using a TTV and the methodology described in the Intel® Xeon® Processor Family Thermal Test Vehicle User's Guide. The test results, for a number of samples, are reported in terms of a worst-case mean + 3σ value for thermal characterization parameter using real processors (based on the TTV correction offset). Environmental Reliability Testing Structural Reliability Testing The Intel reference heatsinks will be tested in an assembled condition, along with the LGA771 Socket. Details of the Environmental Requirements, and associated stress tests, can be found in the LGA771 Socket Mechanical Design Guide. The use condition environment definitions provided in Appendix E-1 are based on speculative use condition assumptions, and are provided as examples only. Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG) 93