Intel X5365 Design Guide - Page 98

Enabled Suppliers Information

98

Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines

Note:

CEK771-02-1U is the 1U alternative reference heatsink design for Quad-Core Intel® Xeon® Processor E5300 Series and

Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors.

F.1.2

Additional Suppliers

The Intel enabled solutions for Quad-Core Intel

®

Xeon

®

Processor 5300 Series are

preliminary. The Intel enabled solutions have not been verified to meet the criteria

outlined in

Appendix E

. Customers can purchase the Intel enabled thermal solution

components from the suppliers listed in

Table F-1

and

Table F-2

.

For additional details, please refer to the Quad-Core Intel

®

Xeon

®

Processor 5300

Series thermal mechanical enabling components drawings in

Appendix B

.

CEK771-01-1U

(for 1U)

CEK Heatsink

Intel p/n C90546

rev02

Copper Fin, Copper

Base

Fujikura

CNDA# 1242012

(stacked fin)

Fujikura America

Ash Ooe

[email protected]

408-748-6991

Fujikura Taiwan Branch

Yao-Hsien Huang

[email protected]

886(2)8788-4959

Thermal Interface

Material

See CEK771-01-2U

CEK Spring for

CEK771

See CEK771-01-2U

CEK771-02-1U

(for 1U)

1U Alternative

Heatsink

Intel p/n D71537

Rev 02

Aluminum

Extrusion

Asia Vital

Components

(AVC)

CNDA# AP5281

David Chao

[email protected]

+886 (2) 2299-6930 x7619

Thermal Interface

Material

See CEK771-01-2U

CEK Spring for

CEK771

See CEK771-01-2U

Table F-1.

Suppliers for the Quad-Core Intel

®

Xeon

®

Processor 5300 Series

Intel Reference Solution (Sheet 2 of 2)

Assembly

Component

Description

Development

Suppliers

Supplier Contact Info

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97

Intel X5365 Design Guide - Page 98

F.1.2, Additional Suppliers, Table F-1., Suppliers for the Quad-Core Intel, Processor 5300 Series

Page 98 highlights