Home » Intel Manuals » Processors » Intel X5365 » Manual Viewer

Intel X5365 Design Guide - Page 58

U CEK Reference Solution, Thermal Profile, Y=0.360*X+42, Equation A-2. y = 0.325x + 40

UPC - 735858199292

Add to My Manuals
Save this manual to your list of manuals

Page 58 highlights

1U Alternative Heatsink Thermal/Mechanical Design The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor L5300 Series in volumetrically constrained form factors. From Table A-1 the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.325 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as: Equation A-2. y = 0.325x + 40 where, y = Processor TCASE value (°C) x = Processor power value (W) Figure A-4 below shows the comparison of this reference thermal solution's Thermal Profile to the Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 2.8°C margin at the lower end (P_PROFILE_MIN) and 3.7°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions. Figure A-4. 1U Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile 60 TCASE_MAX @ TDP Thermal Profile Y=0.360*X+42 55 TCASE_MAX @P _PROFILE_MIN 50 Temperature ( C ) 45 1U CEK Reference Solution Y=0.325*X+40 40 0 5 10 15 20 25 30 P_ PROFILE_MIN 35 40 45 Power (W) 50 TDP § 58 Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines (TMDG)

Section	Page
1 Introduction	9
1.1 Objective	9
1.2 Scope	9
1.3 References	9
1.4 Definition of Terms	10
2 Thermal/Mechanical Reference Design	13
2.1 Mechanical Requirements	13
2.1.1 Processor Mechanical Parameters	13
2.1.2 Quad-Core Intel® Xeon® Processor 5300 Series Package	14
2.1.3 Quad-Core Intel® Xeon® Processor 5300 Series Considerations	18
2.2 Processor Thermal Parameters and Features	18
2.2.1 Thermal Control Circuit and TDP	18
2.2.2 Digital Thermal Sensor	20
2.2.3 Platform Environmental Control Interface (PECI)	20
2.2.4 Multiple Core Special Considerations	21
2.2.5 Thermal Profile	24
2.2.6 TCONTROL Definition	25
2.2.7 Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series	26
2.2.8 Performance Targets	28
2.3 Characterizing Cooling Solution Performance Requirements	33
2.3.1 Fan Speed Control	33
2.3.2 Processor Thermal Characterization Parameter Relationships	35
2.3.3 Chassis Thermal Design Considerations	37
2.4 Thermal/Mechanical Reference Design Considerations	37
2.4.1 Heatsink Solutions	37
2.4.2 Thermal Interface Material	38
2.4.3 Summary	39
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design	40
2.4.5 Thermal Solution Performance Characteristics	42
2.4.6 Thermal Profile Adherence	43
2.4.7 Components Overview	47
2.4.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series	51
A 1U Alternative Heatsink Thermal/Mechanical Design	55
A.1 Component Overview	55
A.2 Thermal Solution Performance Characteristics	56
A.3 Thermal Profile Adherence	57
B Mechanical Drawings	59
C Heatsink Clip Load Methodology	85
C.1 Overview	85
C.2 Test Preparation	85
C.2.1 Heatsink Preparation	85
C.2.2 Typical Test Equipment	88
C.2.3 Test Procedure Examples	88
C.2.4 Time-Zero, Room Temperature Preload Measurement	88
C.2.5 Preload Degradation under Bake Conditions	89
D Safety Requirements	91
E Quality and Reliability Requirements	93
E.1 Intel Verification Criteria for the Reference Designs	93
E.1.1 Reference Heatsink Thermal Verification	93
E.1.2 Environmental Reliability Testing	93
E.1.3 Material and Recycling Requirements	95
F Enabled Suppliers Information	97
F.1 Supplier Information	97
F.1.1 Intel Enabled Suppliers	97